9
8
7
6
5
4
3
2
1
E
注記
NOTES
1. ½品詳細寸法については½品単½図面を参考下さい。
DETAIL DEMENSIONS, SEE PRODUCT DRAWING.
2.
梱包数量：6000個/リール
NUMBER OF CONNECTORS : 6000 PCS/REEL
3. リードテープ長さLEAD TAPE LENGTH
E
引き出し方向
PULL OUT
DIRECTION
REEL
100MIN.
引き出し方向
PULL OUT
DIRECTION
トップテープ接着部（空エンボス）
TOP TAPE BONDED PART. (EMPTY)
⌀
380
±
2
D
(
⌀
80)
トップテープリーダー部
TOP TAPE LEADER PART
400MIN.
末端部（空部）
部品挿入部
TAIL PART
COMPONENT
(EMPTY)
SUPPLIER
160MIN.
D
C
C
B
±
1.0
4. 材料 MATERIAL
ポリスチレン (POLYSTYRENE)
キャリアテープ (CARRIER TAPE)
トップテープ
(TOP TAPE)
PET , PE , PEF
リール
(REEL)
ポリスチレン(PS) <リサイクル材を含む>
POLYSTYRENE (PS) <RECYCLE MATERIAL CONTAINED>
2
±
0.5
5. トップテープの剥離強度については、
IEC60286-3
に準拠
TOP TAPE PEEL FORCE IS DEFINED BY IEC60286-3.
C
B
B
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2016/12/22
2017/02/21
2017/02/21
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
DIMENSION UNITS
SCALE
MM
DRWN BY
DATE
NTS
RELEASED
4 PLACES
±
±
±
±
±
MNISHIKAWA
CHK'D BY
DATE
2016/12/22
2017/02/21
DATE
113200
MNISHIKAWA
KTAKAHASHI
MSASAO
A
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.3 FPC CONN. E/O
TAPING PACKAGE (503566-**08 SERIES)
KTAKAHASHI
APPR BY
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
MSASAO
DRAWING SIZE
2017/02/21
THIRD ANGLE PROJECTION
EC NO:
DRWN:
CHK'D:
APPR:
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
9
P1
RELEASE DATE
21.02.2017
8
05:22:24
7
6
5
A
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
503566
DOCUMENT NUMBER
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5035660001
2
PSD
000
1
1 OF 2
9
8
7
6
5
(2.15)
4
3
2
1
A
（FPC挿入深さ）
(INSERTION DEPTH OF FPC)
E
キャビティ番号
CAVITY NO.
C
L
MOLD NO.
HOUSING
金型番号
ODD TERMIANL
奇数極端子
（接点½½）
(CONTACT
POSITION)
(0.65)
EVEN TERMIANL
偶数極端子
（接点½½）
(CONTACT POSITION)
(1.3)
(0.1)
E
ハウジング
0.32
(0.1)
0.52
（テール部長さ）
(DIMENSION OF
SOLDER TAIL)
（テール部長さ）
(DIMENSION OF
SOLDER TAIL)
アクチュエータ
ACTUATOR
SECTION Y-Y
14.4
12.6
12.0
11.4
10.8
10.2
9.6
9.0
8.4
7.2
6.6
6.0
5.4
4.8
4.2
3.6
3.0
2.4
1.8
E
キャビティ番号
SECTION X-X
2.85
D
CAVITY NO.
トレードマーク
TRADE MARK
Y
C
L
（接点間ピッチ）
(PITCH OF
CONTACTS)
0.3
X
2.75
C
Y
(D)
(C)
X
(0.05)
0.65
(13
0
°
)
FITTING NAIL
補強金具
B
0.1
±
0.03
0.6
(PITCH)
0.3
CL
POSITION OF ACTUATOR OPEN
2016/12/22
2017/02/21
2017/02/21
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
(1.69)
(B)
0.15
±
0.03
15.6
13.8
13.2
12.6
12.0
11.4
10.8
10.2
9.6
8.4
7.8
7.2
6.6
6.0
5.4
4.8
4.2
3.6
3.0
16.42
14.62
14.02
13.42
12.82
12.22
11.62
11.02
10.42
9.22
8.62
8.02
7.42
6.82
6.22
5.62
5.02
4.42
3.82
アクチュエータ開放½½
D
51
503566-5102
D
45
503566-4502
43
503566-4302
41
503566-4102
39
503566-3902
37
503566-3702
35
503566-3502
33
503566-3302
31
503566-3102
27
503566-2702
C
25
503566-2502
23
503566-2302
21
503566-2102
19
503566-1902
17
503566-1702
15
503566-1502
503566-1302
13
503566-1102
11
B
9
503566-0902
極 数
EMBOSSED PACKAGE
C
B
A
オーダー番号 ORDER NO. CIRCUITS
CONNECTOR SERIES NO. 503566-**08
15.0
13.2
12.6
12.0
11.4
10.8
10.2
9.6
9.0
7.8
7.2
6.6
6.0
5.4
4.8
4.2
3.6
3.0
2.4
16.95
15.15
14.55
13.95
13.35
12.75
12.15
11.55
10.95
9.75
9.15
8.55
7.95
7.35
6.75
6.15
5.55
4.95
4.35
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
0.95
±
0.05
SCALE
MM
DRWN BY
DATE
NTS
RELEASED
4 PLACES
±
±
±
±
±
MNISHIKAWA
CHK'D BY
DATE
2016/12/22
2017/02/21
DATE
113200
MNISHIKAWA
KTAKAHASHI
MSASAO
A
0.1
±
0.03
0.6
(PITCH)
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.3 FPC CONN E/O
BTM CONTACT TYPE HGT=0.95MM
KTAKAHASHI
APPR BY
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
MSASAO
DRAWING SIZE
2017/02/21
THIRD ANGLE PROJECTION
EC NO:
DRWN:
CHK'D:
APPR:
E
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
9
P1
RELEASE DATE
21.02.2017
8
05:22:25
7
6
5
A
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
503566
DOCUMENT NUMBER
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5035661001
2
PSD
000
1
1 OF 2
9
8
7
6
0.3X(N+1)+1.3
±
0.05
0.3X(N+1)
±
0.05
5
4
0.52
±
0.05
3
0.3
±
0.05
0.6
±
0.05
(PITCH)
2
0.3X(N-3)
±
0.05
1
0.25
±
0.15
E
0.95
±
0.15
0.85
±
0.15
端子部メッキ
PLATING
0.2
±
0.03
仕上がり厚さ
THICKNESS
0.3
±
0.07
0.3X(N-1)
±
0.03
0.6
±
0.02
(PITCH)
0.3
±
0.07
0.3
+0.04
-0.03
(0.15)
0.25
±
0.05
0.25
±
0.05
R0.15
±
0.05
TYP.(2)
E
1.81
±
0.05
1.15
±
0.05
2.35
±
0.3
1.7
±
0.05
*1
(OVERLAP)
0.72
±
0.05
R0.15
±
0.05
TYP.(8)
（補強板）
(STIFFENER BOARD)
3.5
±
0.5
0.5MIN.
(0.15)
0.03MIN.
0.03MIN.
0.6
±
0.05
(PITCH)
0.25
±
0.05
D
(0.1)
0.85
±
0.05
0.3
±
0.05
0.3
±
0.05
1.5MIN.
D
0.71
±
0.05
補強板：ポリイミド
STIFFNER BOARD: POLYIMIDE
熱硬化接着剤
THERMOSETTING ADHESHIVE
ベースフィルム：ポリイミド（25μm）
BASE FILM: POLYIMIDE（25μm）
熱硬化接着剤
THERMOSETTING ADHESHIVE
導½部：銅箔（35μm）
COPPER FOIL（35μm）
熱硬化接着剤
THERMOSETTING ADHESHIVE
カバーレイ：ポリイミド（25μm）
COVER FILM: POLYIMIDE（25μm）
0.3X(N-1)
±
0.05
0.71
±
0.05
0.3
±
0.02
0.6
±
0.02
(PITCH)
0.12
±
0.03
0.3
+0.04
-0.03
RECOMMENDED PCB
PATTERN DIMENSIONS(REF.)
推奨ペースト厚
推奨マスク開口率
: 100μm
: 80%
RECOMMEND SCREEN THICKNESS : 100μm
RECOMMEND SCREEN OPEN RATIO : 80%
参考基板レイアウト
C
適合するFPC推奨寸法（参考）
APPLICABLE FPC
PATTERN DIMENSIONS(REF.)
（端子部仕上がり厚さ： ）
0.2
±
0.03
(THICKNESS: 0.2
±
0.03)
C
FPC構成推奨仕様
STRUCTURE OF FPC
B
FPC
について
(ABOUT FPC)
・
抜き方向は、導½側から補強板側を推奨します
補強板材質はポリイミド、接着剤は熱硬化接着剤を推奨します
なお、接着剤の接点部への付着は導通不良の原因となりますので
染み出しがないよう、お願いします
注記
NOTES
1.½用材料
MATERIALS
ハウジング
：液晶ポリマー（LCP）、ガラス充填、UL94V-0、ナチュラル（½色系）
アクチュエータ ：ポリアミド（PA）、ガラス充填、UL94V-HB、黒色
奇数端子
：燐青銅、ニッケル下地、金メッキ
偶数端子
：燐青銅、ニッケル下地、金メッキ
補強金具
：燐青銅、ニッケル下地、金メッキ
HOUSING
ACTUATOR
ODD TERMINAL
EVEN TERMINAL
FITTING NAIL
: LIQUID CRYSTAL POLYMER(LCP), GLASS FILLED
UL94V-0, NATURAL(WHITE)
: POLYAMIDE（PA）, GLASS FILLED
UL94V-HB, BLACK
: PHOSPHOR BRONZE, Gold OVER Nickel PLATING
: PHOSPHOR BRONZE, Gold OVER Nickel PLATING
: PHOSPHOR BRONZE, Gold OVER Nickel PLATING
B
2. 端子、補強金具のコプラナリティーは0.1以下とする
3.
4.
RELEASED
113200
MNISHIKAWA
KTAKAHASHI
MSASAO
A
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFENER BORAD SIDE
RECOMMENDED MATERIAL:
STIFFENER BOARD: POLYIMIDE
BONDING AGENT: THERMOSETTING AGENT
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON
ADHEREND BECAUSE THERE IS A POSSIBILITY THAT
THE EXTRA ADHESIVE CAUSES THE DEFECT IN ELECTRICAL CONTINUITY
・ パターンメッキ仕様
FPC
金メッキ：
0.1μm
以上
2~6μm
下地ニッケルメッキ：
FPC PATTERN PLATING
GOLD PLATING
: 0.1μm MINIMUM
NICKEL UNDER PLATING : 2~6μm
COPLANALITY OF SOLDER TAILS AND FITTING NAILS: 0.1MAX.
一般公差：
±
0.3
GENERAL TOLERANCES:
±
0.3
ELV AND RoHS COMPLIANT
DIMENSION UNITS
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2016/12/22
2017/02/21
2017/02/21
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
SCALE
MM
DRWN BY
DATE
NTS
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
±
±
±
±
±
MNISHIKAWA
CHK'D BY
DATE
2016/12/22
2017/02/21
DATE
0.3 FPC CONN E/O
BTM CONTACT TYPE HGT=0.95MM
KTAKAHASHI
APPR BY
EC NO:
DRWN:
CHK'D:
APPR:
*1
補強板長さが図面通り確保できない場合は、カバーレイと
補強板のオーバーラップ寸法を
0.5mm
以上としてください
WHEN STIFFENER BOARD DIMENSION CAN NOT
SECURE AS DRAWING, PLEASE GIVE THE OVERLAP
SIZE OF COVER FILM AND STIFFENER BOARD AS 0.5mm MINIMUM
P1
RELEASE DATE
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
MSASAO
DRAWING SIZE
2017/02/21
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
DATE: 2015/12/14
9
21.02.2017
8
05:22:25
7
6
5
A
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
503566
DOCUMENT NUMBER
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5035661001
2
PSD
000
1
2 OF 2
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
