5962-9559502HBX datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9559502HBX

5962-9559502HBX: DescriptionSRAM Module, 128KX32, 100ns, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size3MB，939 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

Download Datasheet Parametric View All

5962-9559502HBX Overview

SRAM Module, 128KX32, 100ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-9559502HBX Parametric

Parameter Name	Attribute value
Maker	White Electronic Designs Corporation
package instruction	CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	100 ns
JESD-30 code	S-CQFP-G68
length	23.875 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	23.88 mm

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

Sequential logic multi-ground control circuit

35V, 2A slow start regulated power supply

Multifunctional frequency counting circuit

transistor proximity switch

Pyroelectric infrared detection wireless alarm circuit

Homemade serial download cable using MAX232: Does anyone have a serial port circuit diagram for the MAX232 chip? It would be best if it has been tested and can be used. Thanks....; 未来就在脚下 51mcu

Looking for a usable EVC Chinese simulator: Please send to natuly@126.com Thank you! This can't be downloaded! http://download.eeworld.net/source/1145384...; love2008 Embedded System

M68HC11 MCU University Excellent Application Design Compilation: This book collects and organizes 16 outstanding designs that won the "Motorola M68HC11 MCU Excellent Application Design Competition for Colleges" held in 1995, including 1 first prize, 2 second prizes...; wzt Energy Infrastructure?

As shown in the figure, the netlist is transferred to the PCB, and these four networks form GND_SIGNAL_20640, which is not connected to GND_SIGNAL.: [font=宋体][size=4]As shown in the figure, 6 networks are connected to GND_SIGNAL, but the GND_SIGNAL on this page of the PCB is connected together when the netlist is called, but it is not connected to...; Syber PCB Design

Triode common anode digital tube: The four digital tubes on the experimental board are connected to four transistors respectively. When the base of the transistor is at a high level, the bit is selected, and when the base is at a low ...; zhenglei 51mcu

MSP430 Chinese textbook, mainly examples, easy to understand: :loveliness: MSP430 Chinese textbook, mainly examples, easy to understand [[i] This post was last edited by aishuang on 2011-7-16 12:09 [/i]]...; aishuang Microcontroller MCU

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components