Our instrument needs 24V2A power supply for heating, and we can use WEBENCH for design. Enter the design parameters on the WEBENCH page, select AC, input 220V, and output 24V2A.Click Start Design to g...
Pervasive and deep network connectivity forces engineers to confront and resolve a variety of technical security and reliability issues. As more and more embedded devices work in an open network envir...
Yesterday I received a call from Wuhan Liyuan, saying that they were commissioned by NXP. They didn’t ask my name or anything, but asked me if I had participated in any NXP activities. I couldn’t reme...
Tianxiang TX-1C51 development board, old and useless, all dusty, whole set 120, [url]http://item.taobao.com/item.htm?spm=0.0.0.33.8LmFJO&id=178257290[/url] A minimum system, with LCD interface, 20 yua...
Compared with the same period in 2005, the beginning of 2006 seems to be different: semiconductor inventory is at a suitable level, the traditional post-holiday depression phenomenon has not reappeare...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
According to foreign media reports, researchers at the University of Surrey have developed an artificial intelligence system that can accurately locate the location of equipment in densely populate...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
The difference between a series inverter and a parallel inverter is that they use different oscillation circuits. A series inverter connects L, R, and C in series, while a parallel inverter connect...[Details]
Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
HTTP is the abbreviation of Hypertext Transfer Protocol. It is an application protocol based on TCP/IP communication protocol used to transmit HTML and image files. It is an application-level objec...[Details]
Shanghai, China, August 21, 2025 –
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the launch of the TLX9161T
, an automotive photorelay in a compact SO12L-T pa...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]