K4T1G044QC-ZLE6 datasheet, PDF

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K4T1G044QC-ZLE6: DescriptionDDR DRAM, 256MX4, 0.45ns, CMOS, PBGA60; Categorystorage storage; File Size866KB，45 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K4T1G044QC-ZLE6 Overview

DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA60

K4T1G044QC-ZLE6 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMSUNG
package instruction	FBGA, BGA60,9X11,32
Reach Compliance Code	compliant
Maximum access time	0.45 ns
Maximum clock frequency (fCLK)	333 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B60
JESD-609 code	e1
memory density	1073741824 bit
Memory IC Type	DDR DRAM
memory width	4
Humidity sensitivity level	3
Number of terminals	60
word count	268435456 words
character code	256000000
organize	256MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA60,9X11,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Continuous burst length	4,8
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40

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K4T1G044QC

K4T1G084QC

DDR2 SDRAM

1Gb C-die DDR2 SDRAM Specification

60FBGA & 84FBGA with Lead-Free

(RoHS compliant)

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

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Rev. 1.3 July 2008

K4T1G044QC

K4T1G084QC

DDR2 SDRAM

Table of Contents

1.0 Ordering Information ................................................................................................................... 4

2.0 Key Features ................................................................................................................................. 4

3.0 Package Pinout/Mechanical Dimension & Addressing ............................................................ 5

3.1 x4 package pinout (Top View) : 60ball FBGA Package

....................................................................... 5

3.2 x8 package pinout (Top View) : 60ball FBGA Package

....................................................................... 6

3.3 FBGA Package Dimension(x4/x8)

................................................................................................... 7

4.0 Input/Output Functional Description .......................................................................................... 8

5.0 DDR2 SDRAM Addressing .......................................................................................................... 9

6.0 Absolute Maximum DC Ratings ................................................................................................ 10

7.0 AC & DC Operating Conditions ................................................................................................ 10

7.1 Recommended DC Operating Conditions (SSTL - 1.8)

..................................................................... 10

7.2 Operating Temperature Condition

................................................................................................ 11

7.3 Input DC Logic Level

................................................................................................................... 11

7.4 Input AC Logic Level

................................................................................................................... 11

7.5 AC Input Test Conditions

............................................................................................................. 11

7.6 Differential input AC logic Level

................................................................................................... 12

7.7 Differential AC output parameters

................................................................................................. 12

8.0 ODT DC electrical characteristics ............................................................................................ 12

9.0 OCD default characteristics ...................................................................................................... 13

10.0 IDD Specification Parameters and Test Conditions ............................................................. 14

11.0 DDR2 SDRAM IDD Spec Table ................................................................................................ 16

12.0 Input/Output capacitance ........................................................................................................ 17

13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 ..................................... 17

13.1 Refresh Parameters by Device Density

........................................................................................ 17

13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin

............................................. 17

13.3 Timing parameters by speed grade (DDR2-800 and DDR2-667)

....................................................... 18

13.4 Timing parameters by speed grade (DDR2-533 and DDR2-400)

....................................................... 20

14.0 General notes, which may apply for all AC parameters ....................................................... 22

15.0 Specific Notes for dedicated AC parameters ........................................................................ 24

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Rev. 1.3 July 2008

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