IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | SOP, SOP20,.4 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP20,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 2/6 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| MC74HC574DWD | MC54HC574JS | MC54HC574JDS | MC54HC574AJD | MC74HC574DWDS | |
|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP |
| package instruction | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | DIP | DIP | SOP |
| Encapsulate equivalent code | SOP20,.4 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| surface mount | YES | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | - | 1 | 1 | 1 | - |
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