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HY27SG082G2M-SES

Description
Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48
Categorystorage    storage   
File Size430KB,48 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY27SG082G2M-SES Overview

Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48

HY27SG082G2M-SES Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeSOIC
package instructionVSSOP, TSSOP48,.71,20
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time30 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length15.4 mm
memory density2147483648 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size2K
Number of terminals48
word count268435456 words
character code256000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize256MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP48,.71,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
page size2K words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height0.65 mm
Department size128K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeSLC NAND TYPE
width12 mm
HY27UG(08/16)2G2M Series
HY27SG(08/16)2G2M Series
2Gbit (256Mx8bit / 128Mx16bit) NAND Flash
Document Title
2Gbit (256Mx8bit / 128Mx16bit) NAND Flash Memory
Revision History
Revision
No.
0.0
1) Add Errata
tCLS
Specification
Relaxed value
0
5
Case
Specification
Read(all)
Except for
0.1
Relaxed value ID Read
ID Read
2) Add note.4(table14)
3) Add application note(Power on/off Sequence & Auto sleep mode)
- Texts & figures are added.
4) Change AC parameters
Case
Before
After
x8, x16
x8
x16
tDH
10
10
15
tCLH tWP tALS tALH
10
15
tRC
50
50
60
25
45
0
5
10
15
tDS
20
25
tWC
50
70
tR
25us
27us
History
Initial Draft.
Draft Date
Nov. 19. 2004
Remark
Preliminary
tRP tREH tREA
20
20
25
20
20
30
30
30
30
Jan. 20. 2005
Preliminary
1) Change AC parameters
case
Before
0.2
Afer
x8
x16
x8, x16
tDH
10
15
15
Mar. 03. 2005 Preliminary
2) Add tADL(=100ns) parameters
3) Add Muliti Die Concurrent Operations and Extended Read Status
- Texts and table are added.
4) Edit Table.8
5) Change FBGA Package Dimension
Rev 0.7 / Nov. 2005
1
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