IC 16M X 64 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM-144, Dynamic RAM
| Parameter Name | Attribute value |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIMM |
| package instruction | DIMM, DIMM144,32 |
| Contacts | 144 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | SINGLE BANK PAGE BURST |
| Maximum access time | 7 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 100 MHz |
| I/O type | COMMON |
| JESD-30 code | R-XDMA-X144 |
| length | 67.6 mm |
| memory density | 1073741824 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE |
| memory width | 64 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 144 |
| word count | 16777216 words |
| character code | 16000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16MX64 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM144,32 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum seat height | 26.67 mm |
| self refresh | YES |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 1.2 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | UNSPECIFIED |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| width | 3.8 mm |
| THLY641691FG-10 | THLY641691FG-10L | |
|---|---|---|
| Description | IC 16M X 64 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM-144, Dynamic RAM | IC 16M X 64 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM-144, Dynamic RAM |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIMM | DIMM |
| package instruction | DIMM, DIMM144,32 | DIMM, DIMM144,32 |
| Contacts | 144 | 144 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| access mode | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
| Maximum access time | 7 ns | 7 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 100 MHz | 100 MHz |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-XDMA-X144 | R-XDMA-X144 |
| length | 67.6 mm | 67.6 mm |
| memory density | 1073741824 bit | 1073741824 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| memory width | 64 | 64 |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 144 | 144 |
| word count | 16777216 words | 16777216 words |
| character code | 16000000 | 16000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 16MX64 | 16MX64 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIMM | DIMM |
| Encapsulate equivalent code | DIMM144,32 | DIMM144,32 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 |
| Maximum seat height | 26.67 mm | 26.67 mm |
| self refresh | YES | YES |
| Maximum standby current | 0.008 A | 0.008 A |
| Maximum slew rate | 1.2 mA | 1.2 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | UNSPECIFIED | UNSPECIFIED |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL |
| width | 3.8 mm | 3.8 mm |
京公网安备 11010802033920号
EEWORLD
