(V = +5 V, GND = O V, T = +25 C, unless otherwise noted)
S
A
Parameter
ACCURACY
Scale Factor Deviation
Power Supply Rejection Ratio
SHUTDOWN
Logic High Input Voltage
Logic Low Input Voltage
OUTPUT
TMP35 Output Voltage
TMP36 Output Voltage
TMP37 Output Voltage
Short-Circuit Current
Device Turn-On Time
POWER SUPPLY
Supply Range
Supply Current
Supply Current (Shutdown)
Symbol
Conditions
T
A
= +25°C
2.7 V
≤
+V
S
≤
5.5 V
V
S
= 2.7 V
V
S
= 5.5 V
T
A
= +25°C
T
A
= +25°C
T
A
= +25°C
V
S
= 5.5 V
Output within
±
1°C
100 kΩ 100 pF Load
1
Min
Typ
Max
±
2
Units
°C
m°C/V
V
mV
mV
mV
mV
µA
ms
PSRR
V
IH
V
IL
30
1.8
400
250
750
500
0.5
250
1
I
SC
V+
I
SY
(ON)
I
SY
(OFF)
2.7
Unloaded at +5 V
Unloaded at +5 V
5.5
50
0.5
V
µA
µA
NOTES
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
1
Guaranteed but not tested.
DICE CHARACTERISTICS
Die Size 0.027
×
0.030 inch, 810 sq. mils
(0.685
×
0.762 mm, 0.522 sq. mm)
TRANSISTOR COUNT: 25
Substrate is connected to +V
S
1. V
OUT
1
4
2. GND
3.
SHUTDOWN
4. +V
S
2
3
For additional DICE ordering information, refer to databook.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the TMP35/TMP36/TMP37 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
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