Each independent driver consists of an LED that is
optically coupled to a photodiode array.
The driver output is controlled by means of the highly
effective GaAlAs infrared LED at the input. When the
input current is applied to the LED, the light emitted
activates the photodiode array, and generates the
voltage at the output.
The photodiode array is capable of generating a
floating power source with voltage and current
sufficient to drive high-power MOSFET transistors.
Each photodiode array contains an integrated
turn-off circuit that discharges the external MOSFET
gate when LED current is removed. This eliminates
the need to use external components to facilitate the
discharge. The optically coupled technology provides
3750V
rms
of input to output isolation.
The FDA217 is well suited for use in discrete solid
state relay designs and in other isolated switching
applications.
Approvals
•
UL 1577 Pending
•
EN/IEC 60950 Certified Component:
TUV Certificate: B 09 07 49410 004
Ordering Information
Part #
FDA217
FDA217S
FDA217STR
Description
8-Lead DIP (50/tube)
8-Lead Surface Mount (50/tube)
8-Lead Surface Mount (1000/reel)
Features
•
Dual Independent, Floating Outputs for Parallel,
Series, or Isolated Configuration
•
Replacement of Discrete Components
•
5mA Control Current
•
No EMI/RFI Generation
•
Solid State Reliability
•
High Input to Output Isolation: 3750V
rms
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Version Available
Applications
•
MOSFET Driver
•
Programmable Control
•
Process Control
•
Instrumentation
•
Telecommunications
•
Solid State Relays
•
Isolated Switching
•
Floating Power Supplies
Pin Configuration
+
–
+
–
1
Input
2
3
Input
4
– 8
Output
+
7
–
+
6
Output
5
PV
PV
Pb
DS-FDA217-R01
RoHS
2002/95/EC
e
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1
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Absolute Maximum Ratings @ 25ºC
Parameter
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
ESD Rating, Human Body Model
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
FDA217
Ratings
5
50
1
140
500
8
3750
-40 to +85
-40 to +125
Units
V
mA
A
mW
mW
kV
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Open Circuit Voltage
Short Circuit Current
Conditions
I
F
=5mA
I
F
=5mA
I
F
=10mA
I
F
=15mA
I
F
=20mA
I
F
=30mA
I
F
=5mA, V
LOAD
=5V, C
LOAD
=200pF
V
L
=1V
I
SC
=2.5A
I
F
=5mA
V
R
=5V
-
Symbol
V
OC
Min
10.5
2.5
5
7.5
10
15
-
-
100
-
0.9
-
-
Typ
11.75
4.5
9
13.5
18.5
27
-
-
770
3.8
1.26
-
3
Max
15.3
-
Units
V
I
SC
A
Switching Speeds
Turn-On
Turn-Off
Offstate Resistance
Input Characteristics
LED Current to Activate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
t
on
t
off
R
I
F
V
F
I
R
-
2
0.5
3300
5
1.4
10
-
ms
mA
V
µA
pF
2
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Performance Data (@ 25ºC Unless Otherwise Noted) *
Typical LED Forward Voltage
(N=50, I
F
=5mA)
20
FDA217
25
20
15
10
5
0
Typical Open-Circuit Voltage
(N=50, I
F
=5mA)
20
Typical Short-Circuit Current
(N=50, I
F
=5mA)
Device Count (N)
Device Count (N)
Device Count (N)
15
15
10
10
5
5
0
1.250
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
1.275
11.35 11.45 11.55 11.65 11.75 11.85 11.95
Open-Circuit Voltage (V)
0
3.7
4.0
4.3
4.6
4.9
5.2
Short Circuit Current ( A)
5.5
LED Forward Voltage
vs. Forward Current
50
Forward Current (mA)
Turn-On Time (ms)
40
30
20
10
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
Forward Voltage (V)
12
10
8
6
4
2
0
Turn-On Time vs. Load Capacitance
(V
OUT
=5V)
Turn-Off Time (ms)
I
F
=5mA
I
F
=10mA
I
F
=20mA
I
F
=50mA
0.22
0.20
0.18
0.16
0.14
0.12
0.10
Turn-Off Time vs. Load Capacitance
(V
OUT
=5V)
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
0
2000
4000 6000 8000 10000 12000
Load Capacitance (pF)
0
2000
4000 6000 8000 10000 12000
Load Capacitance (pF)
LED Forward Voltage
vs. Temperature
1.6
LED Forward Voltage (V)
Turn-On Time ( s)
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
I
F
=2mA
I
F
=1mA
I
F
=50mA
I
F
=20mA
I
F
=10mA
700
600
500
400
300
200
100
0
-40
Turn-On Time vs. Temperature
(V
out
=5V, C
L
=200pF)
I
F
=5mA
I
F
=10mA
I
F
=20mA
I
F
=50mA
140
130
Turn-Off Time ( s)
120
110
100
90
80
70
Turn-Off Time vs. Temperature
(V
out
=5V, C
L
=200pF)
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Open-Circuit Voltage
vs. Temperature
20
18
16
14
12
10
8
6
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Short-Circuit Current ( A)
Open-Circuit Voltage (V)
50
40
30
20
10
0
-40
-20
Short-Circuit Current
vs. Temperature
900
Output Resistance ( )
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
850
800
750
700
650
600
0
20
40
60
Temperature (ºC)
80
100
Offstate Output Resistance
vs. Temperature
(V
L
=1V, Internal to Photovoltaic Driver)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R01
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Manufacturing Information
Moisture Sensitivity
FDA217
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
FDA217 / FDA217S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
FDA217 / FDA217S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
RoHS
2002/95/EC
e
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Mechanical Dimensions
FDA217
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 TYP
(0.01)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
FDA217
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.889 ± 0.102
(0.035 ± 0.004)
Dimensions
mm
(inches)
FDA217S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
1.65
(0.0649)
8.90
(0.3503)
0.457 ± 0.076
(0.018 ± 0.003)
4.445 ± 0.127
(0.175 ± 0.005)
0.65
(0.0255)
0.813 ± 0.120
(0.032 ± 0.004)
Dimensions
mm
(inches)
FDA217S Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K
0
=4.90
(0.193)
K
1
=4.20
(0.165)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
Embossed Carrier
Embossment
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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