5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email advintcorp@aol.com Internet http://www.advintcorp.com
.100" (2.54 mm) Pitch Board to Board Interconnections
NB/LNB - Single Row
Molded Female
DRS - Dual Row
Molded Female
NA - Single Row
Molded Male
DRA - Dual Row
Molded Male
KSS - Single Row
Peel-A-Way
®
Female
DKS - Dual Row
Peel-A-Way
®
Female
NEW PHOTO
Low Profile
Board to Board
KSA - Single Row
Peel-A-Way
®
Male
DKA - Dual Row
Peel-A-Way
®
Male
Features:
!
High reliability method of
interconnecting.
!
Reliable mechanical support.
!
Complete flexibility. If the board to
board spacing you need is not shown
on pages 54 - 55 , consult factory.
Terminals and Contacts:
Terminal: Brass - Copper Alloy 360,
ASTM-B-16
Contact: Beryllium Copper - Copper
Alloy 172, ASTM-B-194
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Body Material:
Molded -
Glass filled thermoplastic
Polyester (P
.B.T.) U.L. Rated 94V-O,
-60
°
C to 140
°
C (-76
°
F to 284
°
F)
High Temp Molded
- High temp. glass
filled thermoplastic, U.L. Rated 94V-O,
-60
°
C to 260
°
C (-76
°
F to 500
°
F)
Peel-A-Way
®
- Polyimide Film - Temp.
range -269
°
C to 400
°
C(-452
°
F to 752
°
F)
Page 52
How To Order
Single and Dual RowFemale
NB
010
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Body Type
NB/LNB - Single Row Molded
HNB/HLNB - Single Row High Temp Molded
KSS - Single Row Peel-A-Way
®
DRS - Dual Row Molded
HDRS - Dual Row High Temp Molded
DKS - Dual Row Peel-A-Way
®
Number of Pins
NB/LNB - 3 - 32, KSS - 2 - 100
DRS - 20 - 70, DKS - 4 - 200
How To Order
Single and Dual Row Male
NA
Body Type
NA - Single Row Molded
HNA - Single Row High Temp Molded
KSA - Single Row Peel-A-Way
®
DRA - Dual Row Molded
HDRA - Dual Row High Temp Molded
DKA - Dual Row Peel-A-Way
®
010
-68
T
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Number of Pins
NA/HNA - 3 - 32, KSA - 2 - 100
DRA/HDRA - 20 - 70, DKA - 4 - 200
Peel-A-Way® covered by patent rights issued and or pending.
inch/(mm)
Quick turn delivery available on standard terminal types.
.
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 •Email advintcorp@aol.com •Internet http://www.advintcorp.com
®
®
ADVANCED
Board to Board Interconnections
INTERCONNECTIONS
.100" (2.54 mm) Pitch Board to Board Interconnections
Male Terminal Information
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
.070
(2.16)
.030
(.76)
.125
(3.18)
.125
(3.18)
.018 Dia.
(.46) Typ. 2
.018 Dia.
(.46) Typ. 2
Type -79
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
Type -80
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
.085
(2.16)
.125
(3.18)
Type -81
Type -444
.018 Dia.
(.46)
.125
(3.18)
.052
(1.32)
.103
(2.62)
.125
(3.18)
.018 Dia.
(.46)
.018 Dia.
(.46) Typ. 2
Type -68
.018 Dia.
(.46)
.125
(3.18)
.100
(2.54)
Type -43
.018 Dia.
(.46)
.125
(3.18)
Type -399
.018 Dia.
(.46)
.125
(3.18)
Type -185
.018 Dia.
(.46)
.125
(3.18)
.210
(5.33)
.335
(8.51)
.100
(2.54)
.100
(2.54)
.379
(9.63)
.100
(2.54)
.500
(12.70)
Board to Board
.125
(3.18)
.018 Dia.
(.46)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
Type -42
.018 Dia.
(.46)
.125
(3.18)
Type -398
.018 Dia.
(.46)
.125
(3.18)
Type -403
.018 Dia.
(.46)
.125
(3.18)
Type -71
.018 Dia.
(.46)
.125
(3.18)
.585
(14.86)
.100
(2.54)
.100
(2.54)
.679
(17.25)
.100
(2.54)
.750
(19.06)
.100
(2.54)
.835
(21.21)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
Female Terminal Information
Peel-A-Way® Only
.058 Dia.
(1.47)
Type -210
Peel-A-Way® Only
.058 Dia.
(1.47)
Type -85
Type -299*
.050(1.27) Molded Insulator Thickness
.072 Dia.
(1.83)
Type -49*
.072 Dia.
(1.83)
.015
(.38)
.083
(2.11)
.155
(3.94)
.031
(.79)
.095
(2.41)
.155
(3.94)
.082
(2.08)
.095
(2.41)
.028 Dia.
(.71)
.034 Dia.
(.86)
.038 Dia.
(.97)
.025 Dia.
(.64)
Type -04*
.072 Dia.
(1.83)
Type -51*
.072 Dia.
(1.83)
Type -01
Molded Body Only
.072 Dia.
(1.83)
Peel-A-Way® Only
.072 Dia.
(1.83)
Type -33
.120
(3.05)
.130
(3.30)
.165
(4.19)
.165
(4.19)
.110
(2.79)
.028 Dia.
(.71)
.020 Dia.
(.51)
.110
(2.79)
.125
(3.18)
.020 Dia.
(.51)
.125
(3.18)
.020 Dia.
(.51)
inch/(mm)
* These terminal types are available in either molded or Peel-A-Way®.
Peel-A-Way® covered by patent rights issued and or pending.
I have recently been working on multi-serial port communication industrial control software. My program uses Advantech's serial port expansion card. Each serial port connects 5-10 instruments, and the...
A classmate gave me a NUC122SD2AN development board, which is an ARM Cortex M0, but I don’t know how to use it and I found very little information on the Internet, so I would like to ask the experts h...
Love If I leave, we will never meet again. 1. It has been two years. Every spring, when everything is revived, Wan Rong can feel a chill that penetrates his heart. Every day after work, when he turns ...
There are many protocols and boards. The protocols support low-power Bluetooth, ZigBee, Thread and other network applications based on IEEE 802.15.4. Needless to say, the number of boards is one set. ...
littleshrimpSpecial Edition for Assessment Centres
In recent years, the application of single-chip microcomputer systems in the field of industrial measurement and control has become more and more extensive. However, for industrial sites with harsh en...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
The range of an electric vehicle is crucial to the driving experience, and range anxiety is a common headache when driving an electric vehicle. Although the latest electric vehicles can achieve a r...[Details]