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IDT77V400S156BCI

Description
Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CABGA-256
CategoryWireless rf/communication    Telecom circuit   
File Size417KB,26 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT77V400S156BCI Overview

Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CABGA-256

IDT77V400S156BCI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionLBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codenot_compliant
appATM
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Humidity sensitivity level3
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
SwitchStar
TM
ATM Cell Based
8 x 8 1.2Gbps non-blocking
Integrated Switching Memory
Features List
Single chip supports an 8 x 8 port switch at 155Mbps per
port
!
Central Memory Architecture eliminates Head-of-Line
Blocking by sharing the memory array with all ports
!
Low power dissipation
– 330mW (typ.)
!
Data Path Interface (DPI) provides configurable Input and
Output ports; up to 8 receive and 8 transmit ports at
155Mbps
!
Supports data rates up to 1.2Gbps with a 32-bit wide port
configuration; 155Mbps per 4-bit port
!
Can be cascaded for larger switch configurations
!
Fast Input/Output port cycle times
!
Expander and Concentrator function is fully supported by
the Input and Output port configuration options
!
8192 cells (52 to 56 bytes each) of on-chip buffer memory
capacity
!
!
IDT77V400
!
!
!
!
!
!
!
!
Configurable cell lengths of 52, 53, 54, 55, or 56 bytes can
be independently chosen for Input and Output ports
Byte Addition or Byte Subtraction for x4/x8 to x16/x32
conversion capability
Internal header Cyclical Redundancy Check (CRC) and
generation logic on-chip
Header modification, pre-pend, and post-pend operations
available as well as Multicasting and Broadcasting
capability
High-bandwidth control port for queue controller system
block, up to 36 MHz cycle time
Can be used with the companion IDT77V500 Switch
Controller or custom logic for traffic management
Industrial temperature range (-40°C to +85°C) is available
Single +3.3V ± 300mV power supply
Available in an 208-pin Plastic Quad Flat Pack (PQFP) and
256-ball BGA
Block Diagram
External Interface
for Global Setup
and Control
8-bit Processor/
Call Setup
Manager
or IDT77V550
Data
Control
IDT77V500
Switch
Controller
Data
Control
155Mbps
PHY
Port 0
Port 0
155Mbps
PHY
,
IDT77V400
Switching
Memory
155Mbps
PHY
Port 7
Port 7
155Mbps
PHY
3606 drw 01
Figure 1 Typical 8x8 Switch Configuration using the IDT77V400 Switching Memory
SwitchStar and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 26
2001 Integrated Device Technology, Inc.
March 31, 2001
DSC 3606/6

IDT77V400S156BCI Related Products

IDT77V400S156BCI IDT77V400S156BC
Description Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CABGA-256 Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CABGA-256
Is it Rohs certified? incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA
package instruction LBGA, BGA256,16X16,40 LBGA, BGA256,16X16,40
Contacts 256 256
Reach Compliance Code not_compliant not_compliant
app ATM ATM
JESD-30 code S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0
length 17 mm 17 mm
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 256 256
Maximum operating temperature 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Encapsulate equivalent code BGA256,16X16,40 BGA256,16X16,40
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
width 17 mm 17 mm
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