Microprocessor Circuit, CMOS, PDIP40
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SEMTECH |
| Parts packaging code | DIP |
| package instruction | , |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum slew rate | 7 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
| S25C8Q-CP | S25C8Q-CFN | S25C8Q-P | S25C8Q-FN | |
|---|---|---|---|---|
| Description | Microprocessor Circuit, CMOS, PDIP40 | Microprocessor Circuit, CMOS, PQCC44 | Microprocessor Circuit, CMOS, PDIP40 | Microprocessor Circuit, CMOS, PQCC44 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | SEMTECH | SEMTECH | SEMTECH | SEMTECH |
| Parts packaging code | DIP | QFN | DIP | QFN |
| Contacts | 40 | 44 | 40 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 44 | 40 | 44 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 7 mA | 7 mA | 7 mA | 7 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
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