200mW
SURFACE MOUNT SILICON ZENER DIODES
2.4V~51V
SOD-323 PACKAGE
FEATURES
• Planar Die construction
• 200mW Power Dissipation
.016(0.40)
.010(0.25)
BZT52-C2V4S
THRU
BZT52-C51S
Pb Free Product
SOD-323
SOD-323
.106(2.70)
.055(1.40)
.045(1.15)
.091(2.30)
.071(1.80)
.063(1.60)
.039(1.00)
.031(0.80)
• Zener Voltages from 2.4~51V
• Ideally Suited for Automated Assembly Processes
MECHANICAL DATA
• Case: SOD-323 , Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.0046 grams
• Mounting Position: Any
.007(0.18)MAX.
.004(0.10)MAX.
ORDER INFORMATION
•
•
.016(0.40)
.010(0.25)
.010(0.25)MIN.
Packing information
-T1 3K per 7" plastic Reel
Product Type Symbol
RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
PARAMETER
Power Dissipation
at Tamb=25℃
SYMBOL
P
TOT
T
J
,T
S
VALUE
200
-55 to +150
UNIT
mW
℃
Operating Junction and Storage Temperature Range
Valid provided that leads at a distance of 10mm from case kept at ambient temperature.
NOTE :
A. Mounted on 5.0mm
2
(.013mm thick) land areas.
2011-09
WILLAS ELECTRONIC CORP.
200mW
SURFACE MOUNT SILICON ZENER DIODES
2.4V~51V
SOD-323 PACKAGE
BZT52-C2V4S
THRU
BZT52-C51S
Pb Free Product
TEMPERATURE COEFFICIENT,(mV/
O
C)
100
0.6
POWER DISSIPATION, Watts
0.5
0.4
0.3
10
0.2
0.1
0
0
25
50
75
100
125
150
1
10
100
TEMPERATURE (
O
C)
NOMINAL ZENER VOLTAGE,VOLTS
Fig.1 STEADY STATE POWER DERATING
Fig.2 TEMPERATURE COEFFICENTS
1000
1000
LEAKAGE CURRENT,uA
10
1
0.1
0.01
0.001
0.0001
0.00001
0
10
20
30
40
50
60
70
FORWARD CURRENT,mA
100
+150 C
O
100
+25 C
O
10
150
O
C
75
O
C
-55 C
80
90
O
25
O
C
5
O
C
1
0.4
NORMAL ZENER VOLTAGE, VOLTS
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
FORWARD VOLTAGE, VOLTS
Fig.3 TYPICAL LEAKAGE CURRENT
Fig.4 TYPICAL FORWARD VOLTAGE
MOUNTING PAD LAYOUT
SOD-323
2011-09
WILLAS ELECTRONIC CORP.
MCU
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