37000-A1 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > 37000-A1

Preview

37000-A1: DescriptionElectrical Characterization of Packages for Use with GaAs MMIC Amplifiers; File Size128KB，4 Pages; ManufacturerMACOM; Websitehttp://www.macom.com

Download Datasheet Compare View All

37000-A1 Overview

Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers

Preview

Download Datasheet

View All

Application Note

M542

Electrical Characterization of Packages for Use with GaAs

MMIC Amplifiers

Abstract

A test methodology will be presented which combines

the advantage of on-wafer RF probing with a TRL

calibration to create a completely de-embeddable,

novel “test fixture” capable of electrically characteriz-

ing most any style package or device. This scheme

has been used to characterize many of the currently

available microwave packages in order to identify ap-

propriate packages for our MMIC amplifier products

which cover frequencies up to 12 GHz. In addition,

the technique has been employed to characterize in-

jection-molded plastic packages and to evaluate non-

probeable MMIC's.

Package Description

5 lead, ceramic

6 lead, ceramic

Leadless, 6 port, ceramic

7 lead, ceramic

8 lead, ceramic

8 lead, glass

8 lead, glass, ground straps

Leadless, 8 port, ceramic

Leadless, 10 port, ceramic

Kyocera

StratEdge

Kyocera

Rev. V4

Manufacturer

Mini-Systems

Oxley

Alcoa

Introduction

Most package vendors have very little microwave

design and characterization capability. Their lim-

ited characterization efforts typically involve the use

of poor fixturing, which obscures the true frequency

response of the package. Companies specializing

in fixturing, while investing considerable mechani-

cal engineering effort, expend far less on electrical

considerations, often producing fixtures inadequate

for use at microwave frequencies. Consequently,

there is very little microwave performance data

available from package vendors.

Therefore, to evaluate and identify candidate pack-

ages for each of the amplifiers in our MMIC ampli-

fier product line, specific fixturing had to be devel-

oped for each package style considered. A novel

fixturing approach was designed and implemented,

which not only eliminates the need for expensive,

package specific fixtures, but also overcomes the

frequency limitations of traditional connectorized,

plunger-style fixtures. Additionally, a rigorous cali-

bration method was developed which allows com-

plete fixture de-embedding.

This test methodology is applicable to practically

any style device. Table 1 lists the package styles

investigated. Through this work, proper electrical

characterization of commonly used packages has

indicated useful frequency ranges broader than

expected by even the package manufacturers.

This finding has allowed us to use low-cost pack-

ages for frequency applications where our competi-

tors typically resort to high-priced custom pack-

ages.

Table 1. Summary of Packages

Design Approach

To eliminate the need for expensive, device spe-

cific, traditional fixtures and overcome their fre-

quency limitations, an RF probeable ceramic sub-

strate was designed as the interface to the device-

under-test (DUT). Figure 1 illustrates this coplanar

probe to microstrip transition. It is a 50 ohm line

fabricated on 10-mil thick alumina, with an 8-mil

pitch, ground-signal-ground (G-S-G) probe pattern

at one end. The two ground pads are connected to

the substrate backside with 8-mil diameter plated

vias. The G-S-G pattern can be probed using com-

mercially available microwave probes on a stan-

dard microwave probe station. The opposite end of

the substrate can be bonded to a test port of the

DUT.

To complete the “test fixture,” only a thin brass

block is required to serve as the mounting surface

for the ceramic substrates and the DUT. If neces-

sary, the brass block could be machined to com-

pensate for any difference in height between the

substrate and DUT test port. To fixture practically

any DUT, all that is needed is a brass plate and the

probeable ceramic substrates. Figure 2 shows the

configuration used for characterizing our

MAAM71200-H1, a packaged 7-12 GHz GaAs

MMIC low noise amplifier.

Visit www.macomtech.com for additional data sheets and product information.

•

North America

Tel: 800.366.2266 •

Europe

Tel: +353.21.244.6400

•

India

Tel: +91.80.4155721

•

China

Tel: +86.21.2407.1588

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

37000-A1 Related Products

	37000-A1	02350-A2	12000-A1	23000-A1	26100-B1	28000-A1	71200-H1	M542
Description	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers	Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers

Recommended Resources

Circuit controlling flash light by phototransistor

DC circuit fuse melt blown flash indication circuit

One-way operation reverse braking control circuit

9V nickel-cadmium battery charging circuit diagram

3V power flasher

810E computer motherboard circuit diagram_16

I heard that STM32 is of low quality and low price, is this true?: I heard that STM32 is of low quality and low price, is this true?...; luke_evans stm32/stm8

Xiaobai is here to ask for help again. What does this code do?: #includevoid main(void) {WDTCTL = WDTPW + WDTHOLD;// Stop WDTP2DIR = BIT7;// P2.7outputTBCCTL0 = CCIE;// CCR0 interrupt enabledTBCCR0 = 50000;TBCTL = TBSSEL_2 + MC_2;// SMCLK, contmode_BIS_SR(LPM0_bit...; 单片机小白~ stm32/stm8

Where can I find demo code for sending audio I2S data from McASP7 of AM5728?: Where can I find demo code for sending audio I2S data from McASP7 of AM5728?...; huanglei DSP and ARM Processors

power supply: [i=s] This post was last edited by minghai on 2017-3-29 17:49 [/i] Hello everyone, please tell me, does anyone know what kind of power boost IC is M25 or something like that, with 8 pins? 2 pins Vout,...; minghai LED Zone

How to create a timing simulation file (vector waveform file) in the web version of Quartus II: How to create a timing simulation file (vector waveform file) in the web version of Quartus II downloaded from the ALTERA official website? Is it impossible to generate it? Please answer...; 若华 FPGA/CPLD

Which part of designing a product takes the most effort?: It would be better to talk about what kind of product it is. It is mainly about the design stage, such as solution, hardware, software, debugging, testing, etc. It can be supplemented that research, a...; yjqlife2008 Embedded System

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components