DS1302N datasheet, PDF - EEWORLD Datasheet

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DS1302N: DescriptionTrickle Charge Timekeeping Chip; Categorysemiconductor The embedded processor and controller; File Size217KB，14 Pages; ManufacturerTiger Electronic Co.,Ltd.; Websitehttp://www.tgselec.com/

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DS1302N Overview

Trickle Charge Timekeeping Chip

DS1302N Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	2 V
Rated supply voltage	5 V
Processing package description	0.300 INCH, DIP-8
state	TRANSFERRED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	IN-line
Terminal form	THROUGH-hole
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
Maximum FCLK clock frequency	0.0320 MHz
Information access methods	Serial, 3-wire
Microprocessor type	Real Time Clock
Number of timers	0.0

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TIGER ELECTRONIC CO.,LTD

Trickle Charge Timekeeping Chip

FEATURES

Real time clock counts seconds, minutes

hours, date of the month, month, day of the

week, and year with leap year compensation

valid up to 2100

31 x 8 RAM for scratchpad data storage

Serial I/O for minimum pin count

2.0–5.5V full operation

Uses less than 300 nA at 2.0V

Single–byte or multiple–byte (burst mode)

data transfer for read or write of clock or

RAM data

8–pin DIP or optional 8–pin SOICs for

surface mount

Simple 3–wire interface

TTL–compatible (V

= 5V)

Optional industrial temperature range

–40°C to +85°C

DS1202 compatible

Recognized by Underwriters Laboratory

DS1302

PIN ASSIGNMENT

CC2

GND

CC1

SCLK

I/O

RST

DS1302

8-Pin DIP (300 mil)

CC2

GND

CC1

SCLK

I/O

RST

DS1302S 8-Pin SOIC (200 mil)

DS1302Z 8-Pin SOIC (150 mil)

CC2

GND

CC1

SCLK

I/O

RST

ORDERING INFORMATION

PART #

DS1302

DS1302N

DS1302S

DS1302SN

DS1302Z

DS1302ZN

DS1302S-16

DS1302SN-16

DESCRIPTION

8–Pin DIP

8-Pin DIP (Industrial)

8–Pin SOIC (200 mil)

8–Pin SOIC (Industrial)

8–Pin SOIC (150 mil)

8–Pin SOIC (Industrial)

16-Pin SOIC (300 mil)

16-Pin SOIC (Industrial)

16-Pin SOIC

PIN DESCRIPTION

X1, X2

GND

RST

– 32.768 kHz Crystal Pins

– Ground

– Reset

– Data Input/Output

– Serial Clock

– Power Supply Pins

I/O

SCLK

CC1

, V

CC2

DESCRIPTION

The DS1302 Trickle Charge Timekeeping Chip contains a real time clock/calendar and 31 bytes of static

RAM. It communicates with a microprocessor via a simple serial interface. The real time clock/calendar

provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is

automatically adjusted for months with less than 31 days, including corrections for leap year. The clock

operates in either the 24–hour or 12–hour format with an AM/PM indicator

1 of 14

070900

DS1302

X1, X2

–

Connections for a standard 32.768 kHz quartz crystal. The internal oscillator is designed for

operation with a crystal having a specified load capacitance of 6 pF. For more information on crystal

selection and crystal layout considerations, please consult Application Note 58, “Crystal Considerations

with Real Time Clocks.” The DS1302 can also be driven by an external 32.768 kHz oscillator. In

this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is floated.

COMMAND BYTE

The command byte is shown in Figure 2. Each data transfer is initiated by a command byte. The MSB

(Bit 7) must be a logic 1. If it is 0, writes to the DS1302 will be disabled. Bit 6 specifies clock/calendar

data if logic 0 or RAM data if logic 1. Bits 1 through 5 specify the designated registers to be input or

output, and the LSB (bit 0) specifies a write operation (input) if logic 0 or read operation (output) if logic

1. The command byte is always input starting with the LSB (bit 0).

ADDRESS/COMMAND BYTE

Figure 2

RESET AND CLOCK CONTROL

All data transfers are initiated by driving the

RST

input high. The

RST

input serves two functions. First,

RST

turns on the control logic which allows access to the shift register for the address/command

sequence. Second, the

RST

signal provides a method of terminating either single byte or multiple byte

data transfer.

A clock cycle is a sequence of a falling edge followed by a rising edge. For data inputs, data must be

valid during the rising edge of the clock and data bits are output on the falling edge of clock. If the

RST

input is low all data transfer terminates and the I/O pin goes to a high impedance state. Data transfer is

illustrated in Figure 3. At power–up,

RST

must be a logic 0 until V

> 2.0 volts. Also SCLK must be at

a logic 0 when

RST

is driven to a logic 1 state.

DATA INPUT

Following the eight SCLK cycles that input a write command byte, a data byte is input on the rising edge

of the next eight SCLK cycles. Additional SCLK cycles are ignored should they inadvertently occur.

Data is input starting with bit 0.

DATA OUTPUT

Following the eight SCLK cycles that input a read command byte, a data byte is output on the falling

edge of the next eight SCLK cycles. Note that the first data bit to be transmitted occurs on the first falling

edge after the last bit of the command byte is written. Additional SCLK cycles retransmit the data bytes

should they inadvertently occur so long as RST remains high. This operation permits continuous burst

mode read capability. Also, the I/O pin is tri–stated upon each rising edge of SCLK. Data is output

starting with bit 0.

BURST MODE

Burst mode may be specified for either the clock/calendar or the RAM registers by addressing location 31

decimal (address/command bits 1 through 5 = logic 1). As before, bit 6 specifies clock or RAM and bit 0

3 of 14

DS1302

specifies read or write. There is no data storage capacity at locations 9 through 31 in the Clock/Calendar

Registers or location 31 in the RAM registers. Reads or writes in burst mode start with bit 0 of address 0.

When writing to the clock registers in the burst mode, the first eight registers must be written in order for

the data to be transferred. However, when writing to RAM in burst mode it is not necessary to write all

31 bytes for the data to transfer. Each byte that is written to will be transferred to RAM regardless of

whether all 31 bytes are written or not.

CLOCK/CALENDAR

The clock/calendar is contained in seven write/read registers as shown in Figure 4. Data contained in the

clock/ calendar registers is in binary coded decimal format (BCD).

CLOCK HALT FLAG

Bit 7 of the seconds register is defined as the clock halt flag. When this bit is set to logic 1, the clock

oscillator is stopped and the DS1302 is placed into a low–power standby mode with a current drain of less

than 100 nanoamps. When this bit is written to logic 0, the clock will start. The initial power on state is

not defined.

AM-PM/12-24 MODE

Bit 7 of the hours register is defined as the 12– or 24–hour mode select bit. When high, the 12–hour

mode is selected. In the 12–hour mode, bit 5 is the AM/PM bit with logic high being PM. In the 24–hour

mode, bit 5 is the second 10-hour bit (20 – 23 hours).

WRITE PROTECT BIT

Bit 7 of the control register is the write-protect bit. The first seven bits (bits 0 – 6) are forced to 0 and

will always read a 0 when read. Before any write operation to the clock or RAM, bit 7 must be 0. When

high, the write protect bit prevents a write operation to any other register. The initial power on state is not

defined. Therefore the WP bit should be cleared before attempting to write to the device.

TRICKLE CHARGE REGISTER

This register controls the trickle charge characteristics of the DS1302. The simplified schematic of

Figure 5 shows the basic components of the trickle charger. The trickle charge select (TCS) bits (bits

4 -7) control the selection of the trickle charger. In order to prevent accidental enabling, only a pattern of

1010 will enable the trickle charger. All other patterns will disable the trickle charger. The DS1302

powers up with the trickle charger disabled. The diode select (DS) bits (bits 2 – 3) select whether one

diode or two diodes are connected between V

CC2

and V

CC1

. If DS is 01, one diode is selected or if DS is

10, two diodes are selected. If DS is 00 or 11, the trickle charger is disabled independently of TCS. The

RS bits (bits 0 -1) select the resistor that is connected between V

CC2

and V

CC1

. The resistor selected by

the resistor select (RS) bits is as follows:

RS Bits

Resistor

None

Typical Value

None

2 kΩ

4 kΩ

8 kΩ

If RS is 00, the trickle charger is disabled independently of TCS.

4 of 14

DS1302

Diode and resistor selection is determined by the user according to the maximum current desired for

battery or super cap charging. The maximum charging current can be calculated as illustrated in the

following example. Assume that a system power supply of 5 volt is applied to V

CC2

and a super cap is

connected to V

CC1

. Also assume that the trickle charger has been enabled with one diode and resistor R1

between V

CC2

and V

CC1

. The maximum current I

max

would therefore be calculated as follows:

max

= (5.0V – diode drop) / R1

~ (5.0V – 0.7V) / 2 kΩ

~ 2.2 mA

Obviously, as the super cap charges, the voltage drop between V

CC2

and V

CC1

will decrease and therefore

the charge current will decrease.

CLOCK/CALENDAR BURST MODE

The clock/calendar command byte specifies burst mode operation. In this mode the first eight

clock/calendar registers can be consecutively read or written (see Figure 4) starting with bit 0 of address

If the write protect bit is set high when a write clock/calendar burst mode is specified, no data transfer

will occur to any of the eight clock/calendar registers (this includes the control register). The trickle

charger is not accessible in burst mode.

At the beginning of a clock burst read, the current time is transferred to a second set of registers. The

time information is read from these secondary registers, while the clock may continue to run. This

eliminates the need to re-read the registers in case of an update of the main registers during a read.

RAM

The static RAM is 31 x 8 bytes addressed consecutively in the RAM address space.

RAM BURST MODE

The RAM command byte specifies burst mode operation. In this mode, the 31 RAM registers can be

consecutively read or written (see Figure 4) starting with bit 0 of address 0.

A register data format summary is shown in Figure 4.

CRYSTAL SELECTION

A 32.768 kHz crystal can be directly connected to the DS1302 via X1 and X2. The crystal selected for

use should have a specified load capacitance (CL) of 6 pF. For more information on crystal selection and

crystal layout consideration, please consult Application Note 58, “Crystal Considerations with Real

Time Clocks."

5 of 14

DS1302N Related Products

	DS1302N	DS1302	DS1302S	DS1302S-16	DS1302SN	DS1302SN-16	DS1302Z	DS1302ZN
Description	Trickle Charge Timekeeping Chip	0 TIMER(S), REAL TIME CLOCK, PDIP8	0 TIMER(S), REAL TIME CLOCK, PDSO8	0 TIMER(S), REAL TIME CLOCK, PDSO16	Trickle Charge Timekeeping Chip	0 TIMER(S), REAL TIME CLOCK, PDSO16	0 TIMER(S), REAL TIME CLOCK, PDSO8	0 TIMER(S), REAL TIME CLOCK, PDSO8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	16	8	16	8	8
Maximum operating temperature	85 Cel	70 Cel	70 Cel	70 Cel	85 Cel	85 Cel	70 Cel	85 Cel
Minimum operating temperature	-40 Cel	0.0 Cel	0.0 Cel	0.0 Cel	-40 Cel	-40 Cel	0.0 Cel	-40 Cel
Maximum supply/operating voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply/operating voltage	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Rated supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	3.3 V
Processing package description	0.300 INCH, DIP-8	0.300 INCH, DIP-8	0.200 INCH, SOIC-8	0.300 INCH, SOIC-16	0.200 INCH, SOIC-8	0.300 INCH, SOIC-16	0.150 INCH, SOIC-8	0.150 INCH, SOIC-8
state	TRANSFERRED	TRANSFERRED	TRANSFERRED	TRANSFERRED	TRANSFERRED	TRANSFERRED	TRANSFERRED	ACTIVE
packaging shape	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle
Package Size	IN-line	IN-line	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Terminal form	THROUGH-hole	THROUGH-hole	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	pair	pair	pair	pair	pair	pair	pair	pair
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Maximum FCLK clock frequency	0.0320 MHz	0.0320 MHz	0.0320 MHz	0.0320 MHz	0.0320 MHz	0.0320 MHz	0.0320 MHz	0.0320 MHz
Information access methods	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire	Serial, 3-wire
Microprocessor type	Real Time Clock	Real Time Clock	Real Time Clock	Real Time Clock	Real Time Clock	Real Time Clock	Real Time Clock	Real Time Clock
Number of timers	0.0	0.0	0.0	0.0	0.0	0.0	0.0	0.0
Craftsmanship	CMOS	CMOS	CMOS	-	CMOS	-	CMOS	CMOS
surface mount	-	-	Yes	Yes	Yes	Yes	Yes	Yes

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