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BZD27C75P-M

Description
75 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB
CategoryDiscrete semiconductor    diode   
File Size109KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

BZD27C75P-M Overview

75 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB

BZD27C75P-M Parametric

Parameter NameAttribute value
MakerVishay
Parts packaging codeDO-219AB
package instructionR-PDSO-F2
Contacts2
Reach Compliance Codeunknow
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-219AB
JESD-30 codeR-PDSO-F2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.8 W
Certification statusNot Qualified
Nominal reference voltage75 V
surface mountYES
technologyZENER
Terminal formFLAT
Terminal locationDUAL
Maximum voltage tolerance6.04%
Working test current10 mA
BZD27C3V6P-M to BZD27C200P-M
www.vishay.com
Vishay Semiconductors
Zener Diodes with Surge Current Specification
FEATURES
• Sillicon planar Zener diodes
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C/10 s at
terminals
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
UNIT
V
mA
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
Z
specification
Int. construction
VALUE
3.6 to 200
5 to 100
Pulse current
Single
• Halogen-free according to IEC 61249-2-21 definition
ORDERING INFORMATION
DEVICE NAME
BZD27C3V6P-M to
BZD27C200P-M
BZD27C3V6P-M to
BZD27C200P-M
ORDERING CODE
BZD27C3V6P-M to
BZD27C200P-M-series-08
BZD27C3V6P-M to
BZD27C200P-M-series-18
TAPED UNITS PER REEL
3000 per 7" reel (8mm tape)
10 000 per 13" reel (8 mm tape)
MINIMUM ORDER QUANTITY
15 000/box
10 000/box
PACKAGE
PACKAGE NAME
DO-219AB (SMF)
WEIGHT
15 mg
MOLDING COMPOUND MOISTURE SENSITIVITY
FLAMMABILITY RATING
LEVEL
UL 94 V-0
MSL level 1
(according J-STD-020)
SOLDERING
CONDITIONS
260 °C/10 s at terminals
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
TEST CONDITION
T
L
= 80 °C
T
A
= 25 °C
(1)
100 μs square pulse
Non repetitive peak surge power
dissipation
(2)
10/1000 μs waveform
(BZD27-C7V5P-M to BZD27-C100P-M)
10/1000 μs waveform
(BZD27-C110P-M to BZD27-C200P-M)
Mounted on epoxy-glass PCB with 3 mm x
3 mm Cu pads ( 40 μm thick)
SYMBOL
P
tot
P
tot
P
ZSM
P
RSM
P
RSM
R
thJL
R
thJA
T
j
T
stg
VALUE
2300
800
300
150
100
30
180
150
- 55 to + 150
UNIT
mW
mW
W
W
W
K/W
K/W
°C
°C
Junction to lead
Junction to ambient air
Junction temperature
Storage temperature range
Notes
(1)
Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)
(2)
T = 25 °C prior to surge
J
Rev. 1.2, 29-Nov-11
Document Number: 83307
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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