TS8542VA
www.vishay.com
Vishay Semiconductors
Specification of High Power IR Emitting Diode Chip
FEATURES
• Package type: chip
• Package form: single chip
• Technology: surface emitter
• Dimensions chip (L x W x H in mm):
1.066 x 1.066 x 0.17
• Peak wavelength:
λ
= 850 nm
• Compliant to RoHS Directive 2011/65/EU and in
accordance to WEEE 2002/96/EC
GENERAL INFORMATION
DESCRIPTION
TS8542VA is a high power infrared, 850 nm surface emitting
diode in GaAlAs technology with high radiant power and
high speed. Polarity Confoguration is “n-up”.
The datasheet is based on Vishay optoelectronics sample
testing under certain predetermined and assumed
conditions, and is provided for illustration purpose only.
Customers are encouraged to perform testing in actual
proposed packaged and used conditions. Vishay
optoelectronics die products are tested using Vishay
optoelectronics based quality assurance procedures and
are manufactured using Vishay optoelectronics established
processes. Estimates such as those described and set forth
in this datasheet for semiconductor die will vary depending
on a number of packaging, handling, use, and other factors.
Therefore sold die may not perform on an equivalent basis
to standard package products.
PRODUCT SUMMARY
COMPONENT
TS8542VA
f
e
(mW)
350
ϕ
(deg)
55
λ
p
(nm)
850
t
r
(ns)
15
Note
• Test condition see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
TS8542VA-SF-F
Note
• MOQ: minimum order quantity
PACKAGING
Wafer sawn on foil
REMARKS
MOQ: 5000 pcs
PACKAGE FORM
Chip
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Forward current
Reverse voltage
Surge forward current
Junction temperature
Storage temperature range chip
Storage temperature range on foil
Temperature during packaging
t
p
< 10 s
t
p
= 100 μs
TEST CONDITION
SYMBOL
I
F
V
R
I
FSM
T
j
T
stg1
T
stg2
VALUE
1
5
5
140
- 40 to + 125
- 20 to + 65
280
UNIT
A
V
A
°C
°C
°C
°C
Rev. 1.1, 20-Feb-12
Document Number: 83474
1
For technical questions, contact:
optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TS8542VA
www.vishay.com
Vishay Semiconductors
TEST CONDITION
I
F
= 100 mA
I
F
= 1 A
I
F
= 100 mA
I
F
= 1000 mA
SYMBOL
V
F
V
F
φ
e
φ
e
I
e
V
R
ϕ
λ
p
λ
0.5
t
r
, t
f
32
350
7.5
10
50
830
55
850
30
15
60
870
MIN.
TYP.
1.3
2.0
MAX.
1.5
2.5
UNIT
V
V
mW
mW
mW/sr
V
deg
nm
nm
ns
BASIC CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Radiant power
(1)
Radiant intensity
Reverse voltage
Angle of half intensity
Peak wavelength
Spectral bandwidth
Rise time/fall time
(2)
I
F
= 100 mA
I
R
= 10 μA
I
F
= 100 mA
I
F
= 1 A
I
F
= 1 A
I
F
= 1 A, R
L
= 50
Ω
Notes
(1)
The measurements are based on samples of die which are mounted on a TO-18 gold header without resin coating
(2)
The radiant intensity, I , is measured on the geometric axis of the TO-18 header
e
BASIC CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
0°
1
10°
20°
30°
Φ
e, rel
- Relative Radiant Power
I
e, rel
- Relative Radiant Sensitivity
0.75
40°
1.0
0.9
0.8
0.7
50°
60°
70°
80°
0.6
0.4
0.2
0
0.5
0.25
0
650
21776
750
850
950
94 8013
λ-
Wavelength (nm)
Fig. 1 - Relative Spectral Emission
φe
rel
= f (λ)
Fig. 2 - Radiant Characteristics
I
rel
= f(ϕ)
MECHANICAL DIMENSIONS
PARAMETER
Length of chip edge (x-direction)
Length of chip edge (y-direction)
Die height
Diameter of bondpad
SYMBOL
L
x
L
y
H
d
MIN.
TYP.
1.066
1.066
0.17
0.127
MAX.
UNIT
mm
mm
mm
mm
ADDITIONAL INFORMATION
Frontside metallization, anode
Backside metallization, cathode
Dicing
Die bonding technology
Gold alloy
Gold alloy
Sawing
Epoxy bonding
Note
• All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
Rev. 1.1, 20-Feb-12
Document Number: 83474
2
For technical questions, contact:
optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
ϕ
- Angular Displacement
TS8542VA
www.vishay.com
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.
It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as
defined in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
Vishay Semiconductors
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the
wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence
(humidity and contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Rev. 1.1, 20-Feb-12
Document Number: 83474
3
For technical questions, contact:
optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000
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