HMOS 16/32-BIT MICROPROCESSOR
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Contacts | 68 |
| Reach Compliance Code | _compli |
| Address bus width | 24 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 10 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| length | 24.2316 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 7 |
| Number of serial I/Os | |
| Number of terminals | 68 |
| On-chip data RAM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 5.08 mm |
| speed | 10 MHz |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | NMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 24.2316 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
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