FSA880 / FSA881 — USB Port 2:1 Switch with Accessory and Charger Detection
Physical Dimensions
0.10 C
1.80
A
B
2.10
0.663
0.563
(15X)
2X
1
2.60
PIN#1 IDENT
0.40
2.90
TOP VIEW
0.10 C
0.10 C
2X
0.225
(16X)
0.55 MAX.
0.152
RECOMMENDED
LAND PATTERN
TERMINAL SHAPE VARIANTS
0.40
0.60
0.15
0.25
15X
0.15
0.25
NON-PIN 1
0.08 C
0.05
0.00
SEATING C
PLANE
SIDE VIEW
0.45
0.35
5
0.10
0.10
0.30
15X
0.50
PIN 1
Supplier 1
9
0.40
1
0.15
0.25
PIN 1
16
13
0.30
0.50
0.15
15X
0.25
NON-PIN 1
0.3015X
0.50
PIN#1 IDENT
0.55
0.45
0.25
0.15
0.10 C A B
0.05 C
Supplier 2
BOTTOM VIEW
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP16Arev4.
F. TERMINAL SHAPE MAY VARY ACCORDING
TO PACKAGE SUPPLIER, SEE TERMINAL
SHAPE VARIANTS.
R0.20
PACKAGE
EDGE
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
Figure 24. 16-Lead Ultrathin Molded Leadless Package (UMLP), 1.8mm x 2.6mm x 0.55mm, 0.4mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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NXP MCU
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