d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 65168
S09-1394-Rev. A, 20-Jul-09
www.vishay.com
1
Symbol
R
thJA
R
thJC
Typical
43
9.5
Maximum
55
12
Unit
New Product
Si5906DU
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 5.3 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 6 A, V
GS
=
0 V
0.8
12
5
6
6
T
C
= 25 °C
6
25
1.2
20
10
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 2.8
Ω
I
D
≅
5.3 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 2.8
Ω
I
D
≅
5.3 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.3
V
DS
= 15 V, V
GS
= 10 V, I
D
= 6.6 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 6.6 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
300
72
34
5.7
2.9
1.0
1.1
1.8
10
90
12
50
5
15
12
5
3.6
15
135
20
75
10
25
20
10
ns
Ω
8.6
4.4
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 4.8 A
V
GS
=
4.5 V, I
D
= 4.1 A
V
DS
= 15 V, I
D
= 4.8 A
20
0.025
0.033
14
0.031
0.040
1.2
30
33
- 3.5
2.2
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 65168
S09-1394-Rev. A, 20-Jul-09
New Product
Si5906DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
25
25 °C, unless otherwise noted
10
20
I
D
- Drain Current (A)
V
GS
= 10
V
thru 4
V
I
D
- Drain Current (A)
8
15
6
T
C
= - 55 °C
4
T
C
= 25 °C
2
T
C
= 125 °C
10
V
GS
= 3
V
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.06
0.12
Transfer Characteristics
0.05
R
DS(on)
- On-Resistance (Ω)
R
DS(on)
- On-Resistance (Ω)
0.10
0.04
V
GS
= 4.5
V
0.08
0.03
V
GS
= 10
V
0.06
V
GS
= 4.5
V
0.04
V
GS
= 10
V
0.02
0.01
0.02
0.00
0
5
10
15
20
25
0.00
0
5
10
15
20
25
30
35
40
I
D
- Drain Current (A)
I
D
- Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
400
350
C
iss
300
C - Capacitance (pF)
250
200
150
C
oss
100
50
C
rss
0
0
5
10
15
20
25
30
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 6.6 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 7.5
V
6
V
DS
= 24
V
4
V
DS
= 15
V
2
0
0
1
2
3
4
5
6
V
DS
- Drain-to-Source
Voltage
(V)
Q
g
- Total Gate Charge (nC)
Capacitance
Gate Charge
Document Number: 65168
S09-1394-Rev. A, 20-Jul-09
www.vishay.com
3
New Product
Si5906DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
1.8
I
D
= 4.8 A
1.6
R
DS(on)
- On-Resistance
V
GS
= 10
V
I
S
- Source Current (A)
T
J
= 150 °C
10
100
1.4
(Normalized)
V
GS
= 4.5
V
1.2
T
J
= 25 °C
1
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
0.1
0.0
0.3
0.6
0.9
1.2
T
J
- Junction Temperature (°C)
V
SD
- Source-to-Drain
Voltage
(V)
On-Resistance vs. Junction Temperature
0.08
2.0
1.9
R
DS(on)
- On-Resistance (Ω)
0.06
I
D
= 4.8 A; T
J
= 125 °C
V
GS(th)
(V)
1.7
1.6
1.5
1.4
I
D
= 1 A; T
J
= 25 °C
1.3
0.00
0
2
4
6
8
10
1.2
- 50
1.8
Source-Drain Diode Forward Voltage
I
D
= 250
µA
0.04
I
D
= 1 A; T
J
= 125 °C
I
D
= 4.8 A; T
J
= 25 °C
0.02
- 25
0
25
50
75
100
125
150
V
GS
- Gate-to-Source
Voltage
(V)
T
J
- Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
30
Threshold Voltage
100
Limited
by
R
DS(on)
*
25
10
20
Power (W)
I
D
- Drain Current (A)
100
µs
1
15
1 ms
10 ms
10
0.1
5
100 ms
1 s, 10 s
T
A
= 25 °C
Single Pulse
BVDSS Limited
DC
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
0.01
0.1
Single Pulse Power (Junction-to-Ambient)
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 65168
S09-1394-Rev. A, 20-Jul-09
New Product
Si5906DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
16
25 °C, unless otherwise noted
12
10
Power Dissipation (W)
I
D
- Drain Current (A)
12
8
8
Package Limited
6
4
4
2
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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