KS430-33TT datasheet, PDF - EEWORLD Datasheet

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KS430-33TT: DescriptionIC Socket, DIP30, 30 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,; CategoryThe connector socket; File Size173KB，2 Pages; ManufacturerAdvanced Interconnections Corp.

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KS430-33TT Overview

IC Socket, DIP30, 30 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

KS430-33TT Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	LOW PROFILE
body width	2.4 inch
subject depth	0.165 inch
body length	2.4 inch
Contact structure	24X24
Contact to complete cooperation	TIN LEAD OVER NICKEL
Contact completed and terminated	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact material	BERYLLIUM COPPER/COPPER ALLOY
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	DIP30
Shell material	POLYAMIDE
JESD-609 code	e0
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	30
Maximum operating temperature	400 °C
Minimum operating temperature	-269 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER

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DIP Sockets

Table of Models

Peel-A-Way DIP Socket Terminal Carriers

Description:

Peel-A-Way

(KS)

Material: Polyimide Film

Index: -269°C to 400°C (-452°F to 752°F)

.005

(.13)

Polyimide

Film

Options

Tape Sealant - add 3M to end of part number

• Removable tape seal protects plated contact in harsh environments

• Sealed socket will not allow dirt and other contaminants to enter

socket chamber and become entrapped behind contact fingers

• Spray flux without contaminating contact area

Features:

• Peel away terminal carrier after

soldering.

• Disposable carrier.

• Complete soldering visibility on

both sides of PCB.

• Maximum air flow.

• Better flux rinse.

• No contact damage due to

terminal carrier insertion.

• No contact pull out due to

extraction of terminal carrier.

Material

Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)

Intermittent to 371°C (700°F)

Solder Preform Terminals

Tin/Lead: Type -150

Lead-free: Type -811

.072 Dia.

(1.83)

Tin/Lead: Type -151

Lead-free: Type -812

.072 Dia.

(1.83)

.130

(3.30)

Tin/Lead: Type -111

Lead-free: Type -810

Peel-A-Way

only

.058 Dia.

(1.47)

Specifications:

Terminals:

Brass - Copper Alloy

(C36000) ASTM-B-16

Contacts:

Beryllium Copper - Copper Alloy

(C17200) ASTM-B-194

Solder Preform:

Standard: 63Sn/37Pb

Lead-free: 95.5Sn/4.0Ag/0.5Cu

Plating:

G - Gold over Nickel

M - Matte Tin over Nickel

T - Tin/Lead over Nickel

Gold per MIL-G-45204

Matte Tin per ASTM545-97

Tin/Lead per MIL-P-81728

Nickel per QQ-N-290

.165

(4.19)

Solder

Preform

.125

(3.18)

.020 Dia.

(.51)

Solder

Preform

.031

(.79)

.155

(3.94)

Solder

Preform

.110

(2.79)

.020 Dia.

(.51)

.038 Dia.

(.97)

How To Order

Body Type

RoHS Compliant Insulators:

- 85

Contact Plating

RoHS Compliant:

KS - Peel-A-Way

DIP

G - Gold

T - Tin/Lead

Terminal Plating

RoHS Compliant:

DIP Spacing

3 - .300/(7.62mm)

4 - .400/(10.16mm)

6 - .600/(15.24mm)

9 - .900/(22.86mm)

Number of Pins

(8 to 64)

Additional sizes available - consult factory.

G - Gold

M - Matte Tin

T - Tin/Lead

Terminal Type

See options on next page

Note: Terminals plated with Matte Tin are available only with Gold plated contacts.

Quick-Turn delivery is not available on products with Matte Tin plating.

5 Energy Way, West Warwick, RI 02893 USA

Tel: 800.424.9850 | 401.823.5200

Fax: 401.823.8723

info@advanced.com | www.advanced.com

CAT16-PREVIEW06 Rev. 1/06

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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