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APT1001RBLC

Description
Power MOS VI is a new generation of low gate charge, high voltage N-Channel enhancement mode power MOSFETs
CategoryDiscrete semiconductor    The transistor   
File Size35KB,2 Pages
ManufacturerADPOW
Websitehttp://www.advancedpower.com/
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APT1001RBLC Overview

Power MOS VI is a new generation of low gate charge, high voltage N-Channel enhancement mode power MOSFETs

APT1001RBLC Parametric

Parameter NameAttribute value
MakerADPOW
package instructionFLANGE MOUNT, R-PSFM-T3
Reach Compliance Codeunknow
Avalanche Energy Efficiency Rating (Eas)1210 mJ
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage1000 V
Maximum drain current (ID)11 A
Maximum drain-source on-resistance1 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-247
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)44 A
Certification statusNot Qualified
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
APT1001RBLC
APT1001RSLC
1000V 11A 1.000
W
BLC
D
3
PAK
TO-247
POWER MOS VI
TM
Power MOS VI is a new generation of low gate charge, high voltage
N-Channel enhancement mode power MOSFETs. Lower gate charge is
achieved by optimizing the manufacturing process to minimize C
iss
and C
rss
.
Lower gate charge coupled with Power MOS VI
TM
optimized gate layout,
delivers exceptionally fast switching speeds.
TM
SLC
• Identical Specifications: TO-247 or Surface Mount D
3
PAK Package
• Lower Gate Charge & Capacitance
• Easier To Drive
• 100% Avalanche Tested
• Faster switching
MAXIMUM RATINGS
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
T
J
,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
D
G
S
All Ratings: T
C
= 25°C unless otherwise specified.
APT1001R
UNIT
Volts
Amps
Drain-Source Voltage
Continuous Drain Current @ T
C
= 25°C
Pulsed Drain Current
1
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
C
= 25°C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
1
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
L
A
IC
N
H
C N
TE IO
D AT
E
C
M
N
R
A
O
V
D INF
A
1000
11
44
±30
±40
280
2.24
300
26
30
-55 to 150
(Repetitive and Non-Repetitive)
1
4
Volts
Watts
W/°C
°C
Amps
mJ
1210
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
DSS
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250µA)
On State Drain Current
2
MIN
TYP
MAX
UNIT
Volts
Amps
1000
11
1.00
25
250
±100
3
5
(V
DS
> I
D(on)
x R
DS(on)
Max, V
GS
= 10V)
2
Drain-Source On-State Resistance
(V
GS
= 10V, 0.5 I
D[Cont.]
)
Ohms
µA
nA
Volts
11-99
050-5927 Rev-
Zero Gate Voltage Drain Current (V
DS
= V
DSS
, V
GS
= 0V)
Zero Gate Voltage Drain Current (V
DS
= 0.8 V
DSS
, V
GS
= 0V, T
C
= 125°C)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 1mA)
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
USA
EUROPE
405 S.W. Columbia Street
Chemin de Magret
Bend, Oregon 97702 -1035
F-33700 Merignac - France
Phone: (541) 382-8028
Phone: (33) 5 57 92 15 15
FAX: (541) 388-0364
FAX: (33) 5 56 47 97 61

APT1001RBLC Related Products

APT1001RBLC APT1001 APT1001RSLC
Description Power MOS VI is a new generation of low gate charge, high voltage N-Channel enhancement mode power MOSFETs Power MOS VI is a new generation of low gate charge, high voltage N-Channel enhancement mode power MOSFETs Power MOS VI is a new generation of low gate charge, high voltage N-Channel enhancement mode power MOSFETs
Maker ADPOW - ADPOW
package instruction FLANGE MOUNT, R-PSFM-T3 - SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code unknow - unknow
Avalanche Energy Efficiency Rating (Eas) 1210 mJ - 1210 mJ
Shell connection DRAIN - DRAIN
Configuration SINGLE WITH BUILT-IN DIODE - SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 1000 V - 1000 V
Maximum drain current (ID) 11 A - 11 A
Maximum drain-source on-resistance 1 Ω - 1 Ω
FET technology METAL-OXIDE SEMICONDUCTOR - METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSFM-T3 - R-PSSO-G2
Number of components 1 - 1
Number of terminals 3 - 2
Operating mode ENHANCEMENT MODE - ENHANCEMENT MODE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
Package shape RECTANGULAR - RECTANGULAR
Package form FLANGE MOUNT - SMALL OUTLINE
Polarity/channel type N-CHANNEL - N-CHANNEL
Maximum pulsed drain current (IDM) 44 A - 44 A
Certification status Not Qualified - Not Qualified
surface mount NO - YES
Terminal form THROUGH-HOLE - GULL WING
Terminal location SINGLE - SINGLE
transistor applications SWITCHING - SWITCHING
Transistor component materials SILICON - SILICON

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