K10P144M100SF2_1109 datasheet, PDF

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K10P144M100SF2_1109: Description32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144; Categorysemiconductor The embedded processor and controller; File Size2MB，70 Pages; ManufacturerFREESCALE (NXP)

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K10P144M100SF2_1109 Overview

32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144

K10P144M100SF2_1109 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	144
Maximum operating temperature	105 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	1.71 V
Rated supply voltage	3 V
External data bus width	0.0
Number of input and output buses	100
Line speed	100 MHz
Processing package description	20 × 20 MM, LQFP-144
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
packaging shape	SQUARE
Package Size	FLATPACK, LOW PROFILE, FINE PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	MATTE Tin
Terminal location	Four
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
ADC channel	Yes
Address bus width	0.0
Number of digits	32
Maximum FCLK clock frequency	32 MHz
DAC channel	Yes
DMA channel	Yes
Microprocessor type	Reduced Instruction Set Microcontroller
PWM channel	Yes
ROM programming	FLASH

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K10P144M100SF2

Rev. 6, 9/2011

Supports the following:

MK10DX128ZVLQ10,

MK10DX128ZVMD10,

MK10DX256ZVLQ10,

MK10DX256ZVMD10,

MK10DN512ZVLQ10,

MK10DN512ZVMD10

K10 Sub-Family Data Sheet

K10P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital host controller (SDHC)

– I2S module

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................3

1.1 Determining valid orderable parts......................................3

2 Part identification......................................................................3

2.1 Description.........................................................................3

2.2 Format...............................................................................3

2.3 Fields.................................................................................3

2.4 Example............................................................................4

3 Terminology and guidelines......................................................4

3.1 Definition: Operating requirement......................................4

3.2 Definition: Operating behavior...........................................5

3.3 Definition: Attribute............................................................5

3.4 Definition: Rating...............................................................6

3.5 Result of exceeding a rating..............................................6

3.6 Relationship between ratings and operating

requirements......................................................................6

3.7 Guidelines for ratings and operating requirements............7

3.8 Definition: Typical value.....................................................7

3.9 Typical value conditions....................................................8

4 Ratings......................................................................................8

4.1 Thermal handling ratings...................................................9

4.2 Moisture handling ratings..................................................9

4.3 ESD handling ratings.........................................................9

4.4 Voltage and current operating ratings...............................9

5 General.....................................................................................10

5.1 AC electrical characteristics..............................................10

5.2 Nonswitching electrical specifications...............................10

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements.........10

LVD and POR operating requirements.................12

Voltage and current operating behaviors..............12

Power mode transition operating behaviors..........13

Power consumption operating behaviors..............14

EMC radiated emissions operating behaviors.......17

Designing with radiated emissions in mind...........18

Capacitance attributes..........................................18

6.8.3

6.8.4

6.8.5

6.8.6

6.8.7

5.4.2

Thermal attributes.................................................20

6 Peripheral operating requirements and behaviors....................20

6.1 Core modules....................................................................21

6.1.1

6.1.2

Debug trace timing specifications.........................21

JTAG electricals....................................................21

6.2 System modules................................................................24

6.3 Clock modules...................................................................24

6.3.1

6.3.2

6.3.3

MCG specifications...............................................24

Oscillator electrical specifications.........................27

32kHz Oscillator Electrical Characteristics............29

6.4 Memories and memory interfaces.....................................30

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications....................30

EzPort Switching Specifications............................32

Flexbus Switching Specifications..........................32

6.5 Security and integrity modules..........................................35

6.6 Analog...............................................................................35

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications.................................35

CMP and 6-bit DAC electrical specifications.........43

12-bit DAC electrical characteristics.....................46

Voltage reference electrical specifications............49

6.7 Timers................................................................................50

6.8 Communication interfaces.................................................50

6.8.1

6.8.2

CAN switching specifications................................50

DSPI switching specifications (limited voltage

range)....................................................................51

DSPI switching specifications (full voltage range).52

I2C switching specifications..................................54

UART switching specifications..............................54

SDHC specifications.............................................54

I2S switching specifications..................................55

6.9 Human-machine interfaces (HMI)......................................57

6.9.1

TSI electrical specifications...................................57

7 Dimensions...............................................................................58

7.1 Obtaining package dimensions.........................................58

8 Pinout........................................................................................59

8.1 K10 Signal Multiplexing and Pin Assignments..................59

8.2 K10 Pinouts.......................................................................65

9 Revision History........................................................................67

5.3 Switching specifications.....................................................18

5.3.1

5.3.2

Device clock specifications...................................18

General switching specifications...........................18

5.4 Thermal specifications.......................................................19

5.4.1

Thermal operating requirements...........................19

K10 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.

Freescale Semiconductor, Inc.

K10P144M100SF2_1109 Related Products

	K10P144M100SF2_1109	MK10DX128ZVLQ10
Description	32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144	32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144
Number of functions	1	1
Number of terminals	144	144
Maximum operating temperature	105 Cel	105 Cel
Minimum operating temperature	-40 Cel	-40 Cel
Maximum supply/operating voltage	3.6 V	3.6 V
Minimum supply/operating voltage	1.71 V	1.71 V
Rated supply voltage	3 V	3 V
External data bus width	0.0	0.0
Number of input and output buses	100	100
Line speed	100 MHz	100 MHz
Processing package description	20 × 20 MM, LQFP-144	20 × 20 MM, LQFP-144
Lead-free	Yes	Yes
EU RoHS regulations	Yes	Yes
state	ACTIVE	ACTIVE
packaging shape	SQUARE	SQUARE
Package Size	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
surface mount	Yes	Yes
Terminal form	GULL WING	GULL WING
Terminal spacing	0.5000 mm	0.5000 mm
terminal coating	MATTE Tin	MATTE Tin
Terminal location	Four	Four
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy
Temperature level	INDUSTRIAL	INDUSTRIAL
ADC channel	Yes	Yes
Address bus width	0.0	0.0
Number of digits	32	32
Maximum FCLK clock frequency	32 MHz	32 MHz
DAC channel	Yes	Yes
DMA channel	Yes	Yes
Microprocessor type	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller
PWM channel	Yes	Yes
ROM programming	FLASH	FLASH

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