VS-FCSP07H40TR
www.vishay.com
Vishay Semiconductors
FlipKY
®
,
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
FEATURES
• Ultra low V
F
to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Reverse polarity protection
• Current steering
FlipKY
®
• Freewheeling
• Flyback
• Oring
DESCRIPTION
PRODUCT SUMMARY
I
F(AV)
V
R
V
F
at I
F
I
RM
max. at 25 °C
I
RM
max. at 125 °C
T
J
max.
E
AS
0.75 A
40 V
0.47 V
10 μA
3 mA
150 °C
5 mJ
Vishay’s FlipKY
®
product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest V
F
to PCB footprint area in industry. The three pad
0.9 mm x 1.2 mm devices can deliver up to 0.75 A and
occupy only 1.08 mm
2
of board space. The anode and
cathode connections are made through solder bump pads
on one side of the silicon enabling designers to strategically
place the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
V
RRM
I
F(AV)
I
FSM
V
F
T
J
0.75 A
pk
, T
J
= 125 °C
Rectangular waveform
CHARACTERISTICS
MAX.
40
0.75
190
0.47
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V
R
V
RWM
VS-FCSP07H40TR
40
UNITS
V
Revision: 04-Jul-11
Document Number: 94561
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-FCSP07H40TR
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average forward current
Maximum peak one cycle
non-repetitive surge current at 25 °C
Non-repetitive avalanche energy
Repetitive avalanche current
SYMBOL
I
F(AV)
I
FSM
10 ms sine or 6 ms rect. pulse
E
AS
I
AR
TEST CONDITIONS
50 % duty cycle at T
PCB
= 106 °C, rectangular waveform
5 µs sine or 3 µs rect. pulse
Following any rated
load condition and with
rated V
RRM
applied
VALUES
0.75
190
10
5
0.5
mJ
A
A
UNITS
T
J
= 25 °C, I
AS
= 2.0 A, L = 5.0 mH
Current decaying linearly to zero in 1 μs
Frequency limited by T
J
maximum V
A
= 1.5 x V
R
typical
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
0.75 A
Maximum forward voltage drop
See fig. 1
V
FM (1)
1.5 A
0.75 A
1.5 A
TEST CONDITIONS
T
J
= 25 °C
T
J
= 125 °C
V
R
= Rated V
R
T
J
= 25 °C
Maximum reverse leakage current
See fig. 2
I
RM (1)
T
J
= 125 °C
V
R
= 20 V
V
R
= 10 V
V
R
= 5 V
V
R
= Rated V
R
V
R
= 20 V
V
R
= 10 V
V
R
= 5 V
Maximum junction capacitance
Maximum voltage rate of charge
Note
(1)
Pulse width < 300 μs, duty cycle < 2 %
C
T
dV/dt
V
R
= 5 V
DC
(test signal range 100 kHz to 1 MHz), 25 °C
Rated V
R
TYP.
0.51
0.59
0.42
0.52
1
0.2
0.08
0.05
0.7
0.2
0.15
0.125
-
-
MAX.
0.55
0.64
0.47
0.57
10
0.5
0.25
0.15
3
1
0.8
0.5
90
10 000
pF
V/µs
mA
µA
V
UNITS
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and
storage temperature range
Typical thermal resistance,
junction to PCB
Maximum thermal resistance,
junction to ambient
Notes
(1)
(2)
SYMBOL
T
J (1)
, T
Stg
R
thJL (2)
R
thJA
DC operation
TEST CONDITIONS
VALUES
- 55 to 150
35
UNITS
°C
°C/W
150
dP
tot
1
------------ < ------------- thermal runaway condition for a diode on its own heatsink
-
-
dT
J
R
thJA
Mounted on minimum footprint PCB
Revision: 04-Jul-11
Document Number: 94561
2
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-FCSP07H40TR
www.vishay.com
1000
Junction Capacitance - C
T
(p F)
Vishay Semiconductors
T = 25˚C
J
10
100
Instantaneous Forward Current - I
F
(A)
10
0
5
T = 150˚C
J
T = 125˚C
J
T = 25˚C
J
10 15 20 25 30 35 40
Reverse Voltage - V
R
(V)
1
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
160
Allowable Case Temperature (°C)
150
140
130
120
110
100
90
80
70
60
0
Square wave (D=0.50)
80% rated Vr applied
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
DC
DC
see note (2)
(1)
0.1
0.2
0.2
0.4
0.6
0.8
1.0
1.2
0.4
0.6
0.8
1
Forward Voltage Drop - V
FM
(V)
1.2
Average Forward Current - I
F(AV)
(A)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
(Per Leg)
Fig. 4 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
10000
Tj = 150˚C
Average Power Loss (Watts)
0.6
0.5
0.4
0.3
0.2
0.1
0
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
RMS Limit
1000
Reverse Current - I
R
(μA)
125˚C
100
10
1
0.1
0.01
0
5
10
15
20
25
100˚C
75˚C
50˚C
25˚C
DC
30
35
40
0
Reverse Voltage - V
R
(V)
0.2
0.4
0.6
0.8
1
1.2
Average Forward Current - I
F(AV)
(A)
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 5 - Forward Power Loss Characteristics (Per Leg)
Note
(1)
Formula used: T = T - (Pd + Pd
C
J
REV
) x R
thJC
;
Pd = Forward power loss = I
F(AV)
x V
FM
at (I
F(AV)
/D) (see fig. 6); Pd
REV
= Inverse power loss = V
R1
x I
R
(1 - D); I
R
at 80 % V
R
applied
Revision: 04-Jul-11
Document Number: 94561
3
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-FCSP07H40TR
www.vishay.com
Vishay Semiconductors
1000
Non-Repetitive Surge Current - I
FSM
(A)
At Any Rated Load Condition
And With Rated Vrrm Applied
Following Surge
100
10
1
10
100
1000
10000
Square Wave Pulse Duration - t
p
(microsec)
Fig. 6 - Maximum Non-Repetitive Surge Current (Per Leg)
L
High-speed
switch
Freewheel
diode
40HFL40S02
+
V
d
= 25
V
D.U.T.
IRFP460
R
g
= 25
Ω
Current
monitor
Fig. 7 - Unclamped Inductive Test Circuit
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
Packaging information
www.vishay.com/doc?95049
www.vishay.com/doc?95060
www.vishay.com/doc?95062
Revision: 04-Jul-11
Document Number: 94561
4
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Outline Dimensions
Vishay High Power Products
FlipKY
®
0.5 A/0.75 A
DIMENSIONS
in millimeters
0.500
0.200
0.071
2
1
0.300
Assignments
1 = Cathode
2 = Cathode
3 = Anode
0.520
0.460
0.125
0.105
0.700
3
0.300
0.173
0.400
0.914
1.244
1.244
0.300
0.395
0.355
Recommended footprint
0.500
PIN 2 cathode
PI
N
1 cathode
0.350
0.250
0.700
0.350
PIN 3 anode
0.450
Notes
• Dimensioning and tolerancing per ASME Y14.5M-1994
• Controlling dimension: millimeter
Document Number: 95049
Revision: 07-Sep-09
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1
Discrete Device
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