S1C33L03F00A100 datasheet, PDF

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S1C33L03F00A100: Description32-BIT, 50MHz, RISC MICROCONTROLLER, PQFP144, PLASTIC, QFP20-144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，631 Pages; ManufacturerSeiko Epson Corporation

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S1C33L03F00A100 Overview

32-BIT, 50MHz, RISC MICROCONTROLLER, PQFP144, PLASTIC, QFP20-144

S1C33L03F00A100 Parametric

Parameter Name	Attribute value
Maker	Seiko Epson Corporation
Parts packaging code	QFP
package instruction	LFQFP, QFP144,.87SQ,20
Contacts	144
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Has ADC	YES
Other features	OPERATES AT 2 V MINIMUM SUPPLY @ 20 MHZ
Address bus width	24
bit size	32
CPU series	S1C33000
maximum clock frequency	35 MHz
DAC channel	NO
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G144
length	20 mm
Number of I/O lines	42
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP144,.87SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	8192
rom(word)	0
Maximum seat height	1.7 mm
speed	50 MHz
Maximum slew rate	0.09 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

S1C33L03F00A100 Preview

MF1574-01

CMOS 32-BIT SINGLE CHIP MICROCOMPUTER

S1C33L03

Technical Manual

S1C33L03 PRODUCT PART

S1C33L03 FUNCTION PART

NOTICE

No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko

Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or

circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such

as medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there

is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright

infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic

products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export license from

the Ministry of International Trade and Industry or other approval from another government agency.

SEIKO EPSON CORPORATION

S1C33L03 Technical Manual

This manual describes the hardware specifications of the Seiko Epson original 32-bit microcomputer S1C33L03.

S1C33L03 PRODUCT PART

Describes the hardware specifications of the S1C33L03 except for details of the peripheral circuits.

S1C33L03 FUNCTION PART

Describes details of all the peripheral circuit blocks for the S1C33 Family microcomputers.

Refer to the "S1C33000 Core CPU Manual" for details of the S1C33000 32-bit RISC CPU.

Configuration of product number

Devices

33209

00E1

Packing specifications

00 : Besides tape & reel

0A : TCP BL

2 directions

0B : Tape & reel BACK

0C : TCP BR

2 directions

0D : TCP BT

2 directions

0E : TCP BD

2 directions

0F : Tape & reel FRONT

0G : TCP BT

4 directions

0H : TCP BD

4 directions

0J : TCP SL

2 directions

0K : TCP SR

2 directions

0L : Tape & reel LEFT

0M: TCP ST

2 directions

0N : TCP SD

2 directions

0P : TCP ST

4 directions

0Q : TCP SD

4 directions

0R : Tape & reel RIGHT

99 : Specs not fixed

Specification

Package

D: die form; F: QFP

Model number

Model name

C: microcomputer, digital products

Product classification

S1: semiconductor

Development tools

S5U1

33000

Packing specifications

00: standard packing

Version

1: Version 1

Tool type

Hx : ICE

Dx : Evaluation board

Ex : ROM emulation board

Mx : Emulation memory for external ROM

Tx : A socket for mounting

Cx : Compiler package

Sx : Middleware package

Corresponding model number

33L01: for S1C33L01

Tool classification

C: microcomputer use

Product classification

S5U1: development tool for semiconductor products

TABLE OF CONTENTS

S1C33L03 PRODUCT PART

Table of Contents

1 Outline..................................................................................................................................... A-1

1.1 Features.....................................................................................................................................A-1

1.2 Block Diagram ...........................................................................................................................A-3

1.3 Pin Description ..........................................................................................................................A-4

1.3.1 Pin Layout Diagram (plastic package) ......................................................................A-4

1.3.2 Pin Functions .............................................................................................................A-5

2 Power Supply .......................................................................................................................A-12

2.1

2.2

2.3

2.4

Power Supply Pins ..................................................................................................................A-12

Operating Voltage (V

, V

).................................................................................................A-12

Power Supply for I/O Interface (V

DDE

)....................................................................................A-13

Power Supply for Analog Circuits (AV

DDE

).............................................................................A-13

3 Internal Memory...................................................................................................................A-14

3.1 ROM and Boot Address ..........................................................................................................A-14

3.2 RAM .........................................................................................................................................A-15

4 Peripheral Circuits ..............................................................................................................A-16

4.1 List of Peripheral Circuits ........................................................................................................A-16

4.2 I/O Memory Map......................................................................................................................A-17

5 Power-Down Control...........................................................................................................A-65

6 Basic External Wiring Diagram .........................................................................................A-68

7 Precautions on Mounting...................................................................................................A-69

8 Electrical Characteristics ...................................................................................................A-71

Absolute Maximum Rating ......................................................................................................A-71

Recommended Operating Conditions ....................................................................................A-72

DC Characteristics ..................................................................................................................A-73

Current Consumption ..............................................................................................................A-75

A/D Converter Characteristics ................................................................................................A-76

AC Characteristics...................................................................................................................A-78

8.6.1 Symbol Description ..................................................................................................A-78

8.6.2 AC Characteristics Measurement Condition...........................................................A-78

8.6.3 C33 Block AC Characteristic Tables .......................................................................A-79

8.6.4 C33 Block AC Characteristic Timing Charts ...........................................................A-87

8.6.5 LCD Interface AC Characteristics ...........................................................................A-96

8.7 Oscillation Characteristics.................................................................................................... A-107

8.8 PLL Characteristics .............................................................................................................. A-108

8.1

8.2

8.3

8.4

8.5

8.6

9 Package ..............................................................................................................................A-109

9.1 Plastic Package .................................................................................................................... A-109

10 Pad Layout .........................................................................................................................A-110

10.1 Pad Layout Diagram............................................................................................................. A-110

10.2 Pad Coordinate..................................................................................................................... A-111

S1C33L03 TECHNICAL MANUAL

EPSON

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S1C33L03F00A100 Related Products

	S1C33L03F00A100	S1C33L03F00A200
Description	32-BIT, 50MHz, RISC MICROCONTROLLER, PQFP144, PLASTIC, QFP20-144	32-BIT, 50MHz, RISC MICROCONTROLLER, PQFP144, PLASTIC, QFP20-144
Maker	Seiko Epson Corporation	Seiko Epson Corporation
Parts packaging code	QFP	QFP
package instruction	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20
Contacts	144	144
Reach Compliance Code	unknown	unknown
ECCN code	3A991.A.2	3A991.A.2
Has ADC	YES	YES
Other features	OPERATES AT 2 V MINIMUM SUPPLY @ 20 MHZ	OPERATES AT 2 V MINIMUM SUPPLY @ 20 MHZ
Address bus width	24	24
bit size	32	32
CPU series	S1C33000	S1C33000
maximum clock frequency	35 MHz	35 MHz
DAC channel	NO	NO
DMA channel	YES	YES
External data bus width	16	16
JESD-30 code	S-PQFP-G144	S-PQFP-G144
length	20 mm	20 mm
Number of I/O lines	42	42
Number of terminals	144	144
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP
Encapsulate equivalent code	QFP144,.87SQ,20	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	8192	8192
Maximum seat height	1.7 mm	1.7 mm
speed	50 MHz	50 MHz
Maximum slew rate	0.09 mA	0.09 mA
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	2.7 V	2.7 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
width	20 mm	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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