BFU590G
NPN wideband silicon RF transistor
Rev. 1 — 28 April 2014
Product data sheet
1. Product profile
1.1 General description
NPN silicon microwave transistor for high speed, medium power applications in a plastic,
4-pin SOT223 package.
The BFU590G is part of the BFU5 family of transistors, suitable for small signal to medium
power applications up to 2 GHz.
1.2 Features and benefits
Medium power, high linearity, high breakdown voltage RF transistor
AEC-Q101 qualified
Maximum stable gain 13 dB at 900 MHz
P
L(1dB)
21.5 dBm at 900 MHz
8.5 GHz f
T
silicon technology
1.3 Applications
Automotive applications
Broadband amplifiers
Medium power amplifiers (500 mW at a frequency of 433 MHz or 866 MHz)
Large signal amplifiers for ISM applications
1.4 Quick reference data
Table 1.
Quick reference data
T
amb
= 25
C unless otherwise specified
Symbol
V
CB
V
CE
V
EB
I
C
P
tot
h
FE
C
c
f
T
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
total power dissipation
DC current gain
collector capacitance
transition frequency
T
sp
90
C
I
C
= 80 mA; V
CE
= 8 V
V
CB
= 8 V; f = 1 MHz
I
C
= 80 mA; V
CE
= 8 V; f = 900 MHz
[1]
Conditions
open emitter
open base
shorted base
open collector
Min
-
-
-
-
-
-
60
-
-
Typ
-
-
-
-
80
-
95
1.9
8.5
Max
24
12
24
2
200
130
-
-
Unit
V
V
V
V
mA
2000 mW
pF
GHz
NXP Semiconductors
BFU590G
NPN wideband silicon RF transistor
Table 1.
Quick reference data
…continued
T
amb
= 25
C unless otherwise specified
Symbol
G
p(max)
P
L(1dB)
Parameter
maximum power gain
output power at 1 dB gain
compression
Conditions
I
C
= 80 mA; V
CE
= 8 V; f = 900 MHz
I
C
= 80 mA; V
CE
= 8 V; Z
S
= Z
L
= 50
;
f = 900 MHz
[2]
Min
-
-
Typ
13
21.5
Max
-
-
Unit
dB
dBm
[1]
[2]
T
sp
is the temperature at the solder point of the collector lead.
If K > 1 then G
p(max)
is the maximum power gain. If K
1 then G
p(max)
= MSG.
2. Pinning information
Table 2.
Pin
1
2
3
4
Discrete pinning
Description
emitter
base
emitter
collector
Simplified outline
Graphic symbol
3. Ordering information
Table 3.
Ordering information
Package
Name
BFU590G
OM7966
[1]
Type number
Description
plastic surface-mounted package with increased heatsink; 4 leads
Customer evaluation kit for BFU580G and BFU590G
[1]
Version
SOT223
-
-
-
The customer evaluation kit contains the following:
a) Unpopulated RF amplifier Printed-Circuit Board (PCB)
b) Unpopulated RF amplifier Printed-Circuit Board (PCB) with emitter degeneration
c) Four SMA connectors for fitting unpopulated Printed-Circuit Board (PCB)
d) BFU580G and BFU590G samples
e) USB stick with data sheets, application notes, models, S-parameter and noise files
4. Marking
Table 4.
BFU590G
Marking
Marking
BFU590
Type number
BFU590G
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 28 April 2014
2 of 19
NXP Semiconductors
BFU590G
NPN wideband silicon RF transistor
5. Design support
Table 5.
Available design support
Download from the BFU590G product information page on
http://www.nxp.com.
Support item
Device models for Agilent EEsof EDA ADS
SPICE model
S-parameters
Customer evaluation kit
Solder pattern
Application notes
Available
yes
yes
yes
yes
yes
yes
See
Section 10.1
and
Section 10.2.
See
Section 3
and
Section 10.
Remarks
Based on Mextram device model.
Based on Gummel-Poon device
model.
6. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CB
V
CE
V
EB
I
C
T
stg
V
ESD
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
storage temperature
electrostatic discharge voltage
Human Body Model (HBM) According to JEDEC
standard 22-A114E
Charged Device Model (CDM) According to
JEDEC standard 22-C101B
Conditions
open emitter
open base
shorted base
open collector
Min
-
-
-
-
-
65
-
-
Max
30
16
30
3
300
+150
250
2
Unit
V
V
V
V
mA
C
V
kV
7. Recommended operating conditions
Table 7.
Symbol
V
CB
V
CE
V
EB
I
C
P
i
T
j
P
tot
[1]
Characteristics
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
input power
junction temperature
total power dissipation
T
sp
90
C
[1]
Conditions
open emitter
open base
shorted base
open collector
Z
S
= 50
Min
-
-
-
-
-
-
40
-
Typ
-
-
-
-
-
-
-
-
Max
24
12
24
2
200
20
+150
2000
Unit
V
V
V
V
mA
dBm
C
mW
T
sp
is the temperature at the solder point of the collector lead.
BFU590G
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 28 April 2014
3 of 19
NXP Semiconductors
BFU590G
NPN wideband silicon RF transistor
8. Thermal characteristics
Table 8.
Symbol
R
th(j-sp)
[1]
Thermal characteristics
Parameter
thermal resistance from junction to solder point
Conditions
[1]
Typ
30
Unit
K/W
T
sp
is the temperature at the solder point of the collector lead.
T
sp
has the following relation to the ambient temperature T
amb
:
T
sp
= T
amb
+ P
R
th(sp-a)
With P being the power dissipation and R
th(sp-a)
being the thermal resistance between the solder point and
ambient. R
th(sp-a)
is determined by the heat transfer properties in the application.
The heat transfer properties are set by the application board materials, the board layout and the
environment e.g. housing.
Fig 1.
Power derating curve
9. Characteristics
Table 9.
Characteristics
T
amb
= 25
C unless otherwise specified
Symbol
Parameter
Conditions
I
C
= 100 nA; I
E
= 0 mA
I
C
= 150 nA; I
B
= 0 mA
I
E
= 0 mA; V
CB
= 8 V
I
C
= 80 mA; V
CE
= 8 V
V
EB
= 0.5 V; f = 1 MHz
V
CE
= 8 V; f = 1 MHz
V
CB
= 8 V; f = 1 MHz
I
C
= 50 mA; V
CE
= 8 V; f = 900 MHz
Min Typ
24
12
-
-
60
-
-
-
-
-
-
80
<1
95
3.9
1.1
1.9
8.5
Max Unit
-
-
200
-
130
-
-
-
-
pF
pF
pF
GHz
V
V
mA
nA
V
(BR)CBO
collector-base breakdown voltage
V
(BR)CEO
collector-emitter breakdown voltage
I
C
I
CBO
h
FE
C
e
C
re
C
c
f
T
collector current
collector-base cut-off current
DC current gain
emitter capacitance
feedback capacitance
collector capacitance
transition frequency
BFU590G
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 28 April 2014
4 of 19
NXP Semiconductors
BFU590G
NPN wideband silicon RF transistor
Table 9.
Characteristics
…continued
T
amb
= 25
C unless otherwise specified
Symbol
G
p(max)
Parameter
maximum power gain
Conditions
f = 433 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
f = 900 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
f = 1800 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
s
21
2
insertion power gain
f = 433 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
f = 900 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
f = 1800 MHz; V
CE
= 8 V
I
C
= 10 mA
I
C
= 50 mA
I
C
= 80 mA
P
L(1dB)
output power at 1 dB gain compression
f = 433 MHz; V
CE
= 8 V; Z
S
= Z
L
= 50
I
C
= 50 mA
I
C
= 80 mA
f = 900 MHz; V
CE
= 8 V; Z
S
= Z
L
= 50
I
C
= 50 mA
I
C
= 80 mA
f = 1800 MHz; V
CE
= 8 V; Z
S
= Z
L
= 50
I
C
= 50 mA
I
C
= 80 mA
-
-
18.5 -
21
-
dBm
dBm
-
-
19.5 -
21.5 -
dBm
dBm
-
-
20
-
dBm
dBm
22.5 -
-
-
-
4.5
5.5
5.5
-
-
-
dB
dB
dB
-
-
-
10
11
11
-
-
-
dB
dB
dB
-
-
-
16
-
dB
dB
dB
17.5 -
17.5 -
[1]
[1]
[1]
Min Typ
-
-
-
-
-
-
-
-
-
Max Unit
dB
dB
dB
dB
dB
dB
dB
dB
dB
18.5 -
19.5 -
19.5 -
13.5 -
13
13
8
8
8
-
-
-
-
-
BFU590G
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 28 April 2014
5 of 19
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