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MAX7301_06

Description
4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander
File Size924KB,17 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX7301_06 Overview

4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander

MAX7301
4-Wire-Interfaced, 2.5V to 5.5V,
20-Port and 28-Port I/O Expander
General Description
The MAX7301 compact, serial-interfaced I/O expander
(or general-purpose I/O (GPIO) peripheral) provides
microprocessors with up to 28 ports. Each port is individu-
ally user configurable to either a logic input or logic output.
Each port can be configured either as a push-pull logic
output capable of sinking 10mA and sourcing 4.5mA, or
a Schmitt logic input with optional internal pullup. Seven
ports feature configurable transition detection logic, which
generates an interrupt upon change of port logic level.
The MAX7301 is controlled through an SPI-compatible
4-wire serial interface.
The MAX7301AAX and MAX7301ATL have 28 ports and
are available in 36-pin SSOP and 40-pin TQFN packages,
respectively. The MAX7301AAI has 20 ports and is avail-
able in a 28-pin SSOP package.
For a 2-wire I
2
C-interfaced version, refer to the MAX7300
data sheet.
For a pin-compatible port expander with additional
24mA constant-current LED drive capability, refer to the
MAX6957 data sheet.
Benefits and Features
Industry-Standard 4-Wire Interface Simplifies
Expansion of I/O Ports to Up to 28 I/Os Independent
of Microprocessor Architecture
• High-Speed, 26MHz, SPI-/QSPI™-/MICROWIRE
®
-
Compatible Serial Interface
• 2.25V to 5.5V Operation
20 or 28 I/O Ports Configurable as Push-Pull Logic
Output, Schmitt Logic Input or Schmitt Logic Input
with Internal Pullup
• Logic Transition Detection for Seven I/O Ports
Low Power Consumption Reduces Power-Supply
Requirements
11μA (max) Shutdown Current
Typical Operating Circuit
3V
36 V+
47nF
39kΩ
3 GND
2 GND
1
35
ISET
P4 32
P5 30
P6 28
P7 26
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
Applications
MAX7301
White Goods
Gaming Machines
Industrial Controllers
System Monitoring
CHIP SELECT
CLOCK IN
DATA IN
DATA OUT
CS
33
SCLK
34
DIN
4
DOUT
31 P31
29 P30
27 P29
25 P28
24 P27
23 P26
22 P25
21
P24
SSOP
P8 5
P9 7
P10 9
P11 11
P12 6
P13 8
P14 10
P15 12
P16 13
P17 14
P18 15
P19 16
P20 17
P21 18
P22 19
P23 20
Ordering Information
PART
MAX7301AAI+
MAX7301AAX+
MAX7301ATL+
TEMP RANGE
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
PIN-
PACKAGE
28 SSOP
36 SSOP
40 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corp.
Pin Configurations appear at end of data sheet.
19-2438; Rev 8; 4/15

MAX7301_06 Related Products

MAX7301_06 MAX7301AAI+ MAX7301ATL+ MAX7301AAX+T MAX7301AAX+
Description 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander 4-Wire-Interfaced, 2.5V to 5.5V,20-Port and 28-Port I/O Expander 4-Wire-Interfaced, 2.5V to 5.5V,20-Port and 28-Port I/O Expander IC I/O EXPANDER SPI 28B 36SSOP Number of I/Os: 28 Features: - Interface: SPI Clock Frequency: 26MHz
Is it lead-free? - Lead free Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Parts packaging code - SSOP QFN SSOP SSOP
package instruction - SSOP, HVQCCN, SSOP, SSOP,
Contacts - 28 40 36 36
Reach Compliance Code - compli compli compliant compliant
ECCN code - EAR99 EAR99 EAR99 EAR99
Factory Lead Time - 6 weeks 6 weeks 8 weeks 6 weeks
Interface integrated circuit type - INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code - R-PDSO-G28 S-XQCC-N40 R-PDSO-G36 R-PDSO-G36
JESD-609 code - e3 e3 e3 e3
length - 10.2 mm 6 mm 15.415 mm 15.415 mm
Humidity sensitivity level - 1 1 1 1
Number of functions - 1 1 1 1
Number of terminals - 28 40 36 36
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SSOP HVQCCN SSOP SSOP
Package shape - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 260 260 260 260
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.99 mm 0.8 mm 2.64 mm 2.64 mm
Maximum supply voltage - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage - 2.5 V 2.5 V 2.5 V 2.5 V
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form - GULL WING NO LEAD GULL WING GULL WING
Terminal pitch - 0.65 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location - DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 5.29 mm 6 mm 7.495 mm 7.495 mm

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