|
USC68HC138CPD |
USC68HC138CCD |
| Description |
Parallel I/O Port, 8 I/O, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
Parallel I/O Port, 8 I/O, CMOS, CDIP24, 0.300 INCH, CERDIP-24 |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Universal Semiconductor Inc |
Universal Semiconductor Inc |
| Parts packaging code |
DIP |
DIP |
| Contacts |
24 |
24 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| JESD-30 code |
R-PDIP-T24 |
R-GDIP-T24 |
| JESD-609 code |
e0 |
e0 |
| Number of I/O lines |
8 |
8 |
| Number of ports |
8 |
8 |
| Number of terminals |
24 |
24 |
| Maximum operating temperature |
70 °C |
70 °C |
| Package body material |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum supply voltage |
5.25 V |
5.25 V |
| Minimum supply voltage |
4.75 V |
4.75 V |
| Nominal supply voltage |
5 V |
5 V |
| surface mount |
NO |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |