HDLP Series
High Density Low Profile
Connectors
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High density contact arrangement
Light weight Low profile mated height
Surface mount termination technology
Miniature hyperboloid socket contacts
Interfacial seal
Polarized and scoop proof
Pick and place compatible
General Specifications
Insulator Material
Contact Material
Socket Wire Material
Interfacial Seal Material
Guides Material
Contact Plating
Contact Resistance
Current Rating
Contact Life Cycles
Extraction Forces
Temperature Range
Voltage Rating
Contact Diameter
Liquid crystal polymer (LCP)
Copper alloy
Beryllium copper
Fluorosilicone
Stainless steel
ASTM-488-B
(Type II, grade C, Class 1)
8 milliohms max.
2 Amps per contact
2,000+ operations
1.0 oz.
-55° C to 125° C
110 VDC or AC peak nomial
0.015 [0.39]
Current Rating
The Hypertac
®
contact design and manufacturing toler-
ances endow the product with the following attributes:
• Double the current rating of other contact designs
of similar size
• Low contact resistance in high current applications
minimizes temperature rise thereby enabling higher
density interconnects
Contact Plating Finishes
Connector Finish
Ordering Code
Description
Component
Socket
U
Gold Plate
Pin
* PLATING THICKNESS
These values apply to mating surfaces.
Component Finish
Ordering Code
-/9
-/7
Conforms To
ASTM-488-B
(Type II, Grade C, Class 1)
ASTM-488-B
(Type II, Grade C, Class 1)
Plating Thickness*
1.27 µm gold plate min.
50 µin gold plate min.
1.27 µm gold plate min.
50 µin gold plate min.
Dimensions are in inches [mm]
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HDLP Series
HDLP Contact Terminations
Male SMT
Female SMT
Male 90° Printed Circuit Board
Termination Style
H
J
K
Dimension A
0.089 [2.26]
0.124 [3.16]
0.152 [3.86]
Male Vertical Printed Circuit Board
Female Vertical Printed Circuit Board
Termination Style
C
D
E
Dimension A
0.089 [2.26]
0.124 [3.16]
0.152 [3.86]
Termination Style
C
D
E
Dimension A
0.089 [2.26]
0.124 [3.16]
0.152 [3.86]
Dimensions are in inches [mm]
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FPGA/CPLD
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