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WE32K32-90G2UI

Description
EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size569KB,14 Pages
ManufacturerMercury Systems Inc
Download Datasheet Parametric View All

WE32K32-90G2UI Overview

EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CQFP68, 122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WE32K32-90G2UI Parametric

Parameter NameAttribute value
MakerMercury Systems Inc
package instruction122.40 X 122.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time90 ns
Other featuresUSER CONFIGURABLE AS 128K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density1048576 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals68
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.51 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
Maximum write cycle time (tWC)10 ms
WE32K32-XXX
32Kx32 EEPROM MODULE, SMD 5962-94614
FEATURES

Access Times of 125 and 150ns

MIL-STD-883 Compliant Devices Available

Packaging:
• 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880")
square, 3.56mm (0.140") height (Package 510).
• 66-pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)

Data Retention at 25°C, 10 Years

Write Endurance, 10,000 Cycles

Organized as 32Kx32; User Configurable 64Kx16 or
128Kx8

Commercial, Industrial and Military Temperature Ranges

Automatic Page Write Operation

Page Write Cycle Time: 10ms Max

Data Polling for End of Write Detection

Hardware and Software Data Protection

TTL Compatible Inputs and Outputs

5 Volt Power Supply

Low Power CMOS, 10mA Standby Typical

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
* This product is subject to change without notice.
FIGURE 1 – PIN CONFIGURATION FOR WE32K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
NC
NC
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
W E 1 # CS1#
OE#
A0-14
Pin Description
56
I/O0-31
A0-14
WE1-4#
CS1-4#
OE#
V
CC
GND
NC
Data Input/Output
Address Inputs
Write Enable
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
W E 2 # CS2#
W E 3 # CS3#
W E 4 # CS4#
32K x 8
32K x 8
32K x 8
32K x 8
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 9
© 2014 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
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