Binary Counter, Asynchronous, Up Direction, CMOS, CDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | RCA |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Counting direction | UP |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Load/preset input | NO |
| Logic integrated circuit type | BINARY COUNTER |
| Operating mode | ASYNCHRONOUS |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| CD4045BFX | CD4045BE98 | CD4045BD/3 | CD4045BD/3W | CD4045BF/3W | |
|---|---|---|---|---|---|
| Description | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP16, | Binary Counter, Asynchronous, Up Direction, CMOS, PDIP16, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | RCA | RCA | RCA | RCA | RCA |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Counting direction | UP | UP | UP | UP | UP |
| JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Load/preset input | NO | NO | NO | NO | NO |
| Logic integrated circuit type | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | - | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
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