Modem, PQFP44,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Sierra Semiconductor |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQFP-G44 |
| JESD-609 code | e0 |
| Negative supply voltage rating | -5 V |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP44,.7SQ,40 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.036 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| Telecom integrated circuit types | MODEM |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| SC11196CQ | SC11086CQ | SC11086CV | SC11086CN | SC11196CN | SC11196CV | |
|---|---|---|---|---|---|---|
| Description | Modem, PQFP44, | Modem, PQFP44, | Modem, PQCC28, | Modem, PDIP28, | Modem, PDIP28, | Modem, PQCC28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Sierra Semiconductor | Sierra Semiconductor | Sierra Semiconductor | Sierra Semiconductor | Sierra Semiconductor | Sierra Semiconductor |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J28 | R-PDIP-T28 | R-PDIP-T28 | S-PQCC-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Negative supply voltage rating | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| Number of terminals | 44 | 44 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QCCJ | DIP | DIP | QCCJ |
| Encapsulate equivalent code | QFP44,.7SQ,40 | QFP44,.7SQ,40 | LDCC28,.5SQ | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.036 mA | 0.036 mA | 0.036 mA | 0.036 mA | 0.036 mA | 0.036 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | YES |
| Telecom integrated circuit types | MODEM | MODEM | MODEM | MODEM | MODEM | MODEM |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| Terminal pitch | 1 mm | 1 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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