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TSPC603EVAU2LN

Description
Microprocessor,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size562KB,38 Pages
ManufacturerThomson-CSF Compsants Specific
Download Datasheet Parametric View All

TSPC603EVAU2LN Overview

Microprocessor,

TSPC603EVAU2LN Parametric

Parameter NameAttribute value
MakerThomson-CSF Compsants Specific
package instruction,
Reach Compliance Codeunknown
TSPC603E
PowerPC 603e™ RISC MICROPROCESSOR Family
PID6-603e Specification
DESCRIPTION
The PID6-603e implementation of PC603e (after named 603e)
is a low-power implementation of reduced instruction set com-
puter (RISC) microprocessors PowerPC™ family. The 603e
implements 32-bit effective addresses, integer data types of 8,
16 and 32 bits, and floating-point data types of 32 and 64 bits.
The 603e is a low-power 3.3-volt design and provides four soft-
ware controllable power-saving modes.
The 603e is a superscalar processor capable of issuing and
retiring as many as three instructions per clock. Instructions
can execute out of order for increased performance ; however,
the 603e makes completion appear sequential. The 603e inte-
grates five execution units and is able to execute five instruc-
tions in parallel.
The 603e provides independent on-chip, 16-Kbyte, four-way
set-associative, physically addressed caches for instructions
and data and on-chip instruction and data memory manage-
ment units (MMUs). The MMUs contain 64-entry, two-way set-
associative, data and instruction translation lookaside buffers
that provide support for demand-paged virtual memory
address translation and variable-sized block translation.
The 603e has a selectable 32 or 64-bit data bus and a 32-bit
address bus. The 603e interface protocol allows multiple mas-
ters to complete for system resources through a central exter-
nal arbiter. The 603e supports single-beat and burst data
transfers for memory accesses, and supports memory-
mapped I/O.
The 603e uses an advanced, 3.3-V CMOS process technology
and maintains full interface compatibility with TTL devices.
The 603e integrates in system testability and debugging fea-
tures through JTAG boundary-scan capability.
CERQUAD 240
A suffix
CERQUAD 240
Ceramic Leaded Chip Carrier
MAIN FEATURES
H
2.4 SPECint95, 2.1 SPECfp95 @ 100 MHz (estimated)
H
Superscalar (3 instructions per clock peak).
H
Dual 16KB caches.
H
Selectable bus clock.
H
32-bit compatibility PowerPC implementation.
H
On chip debug support.
H
P
D
typical = 3.2 Watts (100 MHz), full operating conditions.
H
Nap, doze and sleep modes for power savings.
H
Branch folding.
H
64-bit data bus (32-bit data bus option).
H
4-Gbyte direct addressing range.
H
Pipelined single/double precision float unit.
H
H
H
H
IEEE 754 compatible FPU.
IEEE P 1149-1 test mode (JTAG/C0P).
f
int
max = 100/120/133 MHz.
f
bus
max = 66 MHz.
Compatible CMOS input
TTL Output.
G suffix
CBGA 255
Ceramic Ball Grid Array
SCREENING / QUALITY / PACKAGING
This product is manufactured in full compliance with :
H
MIL-STD-883 class B or According to TCS standards
H
Upscreenings based upon TCS standards
H
Full military temperature range (T
c
= -55°C, T
c
= +125°C)
Industrial temperature range (T
c
=
40°C, T
c
= +110°C)
H
V
CC
= 3.3 V
±
5 %.
H
240 pin Cerquad or 255 pin CBGA packages
December1998
1/38
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