RISC Microprocessor, 8-Bit, 3MHz, CMOS, CDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Tundra Semiconductor Corp |
| Reach Compliance Code | unknown |
| bit size | 8 |
| JESD-30 code | R-XDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| speed | 3 MHz |
| Maximum slew rate | 17 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| CA80C85B-3CD | CA80C85B-6CD | CA80C85B-5CD | CA80C85B-6ID | CA80C85B-5ID | CA80C85B-3ED | CA80C85B-3ID | CA80C85B-5ED | CA80C85B-6ED | |
|---|---|---|---|---|---|---|---|---|---|
| Description | RISC Microprocessor, 8-Bit, 3MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 3MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 3MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | - | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 3 MHz | 6 MHz | 5 MHz | 6 MHz | 5 MHz | 3 MHz | 3 MHz | 5 MHz | 6 MHz |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Maximum slew rate | 17 mA | - | 21 mA | - | 29 mA | 26 mA | 24 mA | 32 mA | - |
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