HSTTLDM-175 datasheet, PDF - EEWORLD Datasheet

HSTTLDM-175: DescriptionActive Delay Line, 1-Func, 5-Tap, True Output, TTL, MDIP8, 0.280 INCH HEIGHT, HERMETIC SEALED, METAL, MODULE, DIP-14/8; Categorylogic logic; File Size144KB，2 Pages; ManufacturerEngineered Components Co.

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HSTTLDM-175 Overview

Active Delay Line, 1-Func, 5-Tap, True Output, TTL, MDIP8, 0.280 INCH HEIGHT, HERMETIC SEALED, METAL, MODULE, DIP-14/8

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Engineered Components Co.
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14/8
Reach Compliance Code	unknown
Other features	TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 60MA
series	TTL
JESD-30 code	R-MDIP-P8
JESD-609 code	e0
length	20.32 mm
Logic integrated circuit type	ACTIVE DELAY LINE
Number of functions	1
Number of taps/steps	5
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Output polarity	TRUE
Package body material	METAL
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
programmable delay line	NO
Prop。Delay @ Nom-Sup	175 ns
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Total delay nominal (td)	175 ns
width	7.62 mm

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