EEWORLDEEWORLDEEWORLD

Part Number

Search

UPD488448FB-C60-53-DQ1

Description
Rambus DRAM, 8MX16, 53ns, MOS, PBGA62, 11.26 X 13 MM, PLASTIC, FBGA-62
Categorystorage    storage   
File Size1MB,80 Pages
ManufacturerELPIDA
Websitehttp://www.elpida.com/en
Download Datasheet Parametric View All

UPD488448FB-C60-53-DQ1 Overview

Rambus DRAM, 8MX16, 53ns, MOS, PBGA62, 11.26 X 13 MM, PLASTIC, FBGA-62

UPD488448FB-C60-53-DQ1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerELPIDA
Parts packaging codeBGA
package instructionVBGA, BGA62,12X9,40/32
Contacts62
Reach Compliance Codeunknown
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
Maximum access time53 ns
Other featuresSELF CONTAINED REFRESH
Maximum clock frequency (fCLK)600 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B62
JESD-609 codee0
length13 mm
memory density134217728 bit
Memory IC TypeRAMBUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals62
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
organize8MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeVBGA
Encapsulate equivalent codeBGA62,12X9,40/32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE
power supply1.8/2.5,2.5 V
Certification statusNot Qualified
refresh cycle16384
Maximum seat height0.87 mm
self refreshYES
Maximum supply voltage (Vsup)2.63 V
Minimum supply voltage (Vsup)2.37 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width11.26 mm
DATA SHEET
µ
PD488448 for Rev. E
128 M-bit Direct Rambus™ DRAM
MOS INTEGRATED CIRCUIT
EO
Description
Features
Low latency features
The Direct Rambus DRAM (Direct RDRAM) is a general purpose high-performance memory device suitable for use
in a broad range of applications including computer memory, graphics, video, and any other application where high
bandwidth and low latency are required.
The
µ
PD488448 is 128M-bit Direct Rambus DRAM (RDRAM), organized as 8M words by 16 bits.
The use of Rambus Signaling Level (RSL) technology permits 600 MHz to 800 MHz transfer rates while using
conventional system and board design technologies. Direct RDRAM devices are capable of sustained data transfers
at 1.25 ns per two bytes (10 ns per sixteen bytes).
The architecture of the Direct RDRAMs allows the highest sustained bandwidth for multiple, simultaneous randomly
addressed memory transactions. The separate control and data buses with independent row and column control yield
over 95% bus efficiency. The Direct RDRAM’s thirty-two banks support up to four simultaneous transactions.
System oriented features for mobile, graphics and large memory systems include power management, byte masking.
The
µ
PD488448 is offered in a CSP horizontal package suitable for desktop as well as low-profile add-in card and
mobile applications. Direct RDRAMs operate from a 2.5 volt supply.
Highest sustained bandwidth per DRAM device
- 1.6 GB/s sustained data transfer rate
- Separate control and data buses for maximized efficiency
- Separate row and column control buses for easy scheduling and highest performance
- 32 banks: four transactions can take place simultaneously at full bandwidth data rates
- Write buffer to reduce read latency
- Interleaved transactions
- 3 precharge mechanisms for controller flexibility
Advanced power management:
- Power-down self-refresh
- Multiple low power states allows flexibility in power consumption versus time to transition to active state
Organization: 1 Kbyte pages and 32 banks, x 16
Uses Rambus Signaling Level (RSL) for up to 800 MHz operation
Package: 62-pin TAPE FBGA and 62-pin PLASTIC FBGA (D
2
BGA (Die Dimension Ball Grid Array) )
Document No. E0041N11 (Ver. 1.1)
(Previous No. M14587EJ4V0DS00)
Date Published February 2006 CP (K)
Printed in Japan
L
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local Elpida Memory, Inc. for
availability and additional information.
This product became EOL in March, 2004.
Elpida
Memory, Inc. 2001-2006
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
od
Pr
uc
t

Recommended Resources

Popular Articles

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1794  1156  726  917  2195  37  24  15  19  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号