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MJD31_11

Description
Complementary Power Transistors
File Size130KB,10 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet View All

MJD31_11 Overview

Complementary Power Transistors

MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
Complementary Power
Transistors
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching
applications.
Features
http://onsemi.com
Lead Formed for Surface Mount Applications in Plastic Sleeves
Straight Lead Version in Plastic Sleeves (“1” Suffix)
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
Electrically Similar to Popular TIP31 and TIP32 Series
Epoxy Meets UL 94, V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B
u
8000 V
Machine Model, C
u
400 V
These are Pb−Free Packages
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
MJD31, MJD32
MJD31C, MJD32C
Collector−Base Voltage
MJD31, MJD32
MJD31C, MJD32C
Emitter−Base Voltage
Collector Current
Continuous
Peak
Base Current
Total Power Dissipation @ T
C
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
V
EB
I
C
I
B
P
D
P
D
T
J
, T
stg
V
CB
Symbol
V
CEO
Max
40
100
40
100
5
3
5
1
15
0.12
1.56
0.012
−65
to
+ 150
Unit
Vdc
1 2
SILICON
POWER TRANSISTORS
3 AMPERES
40 AND 100 VOLTS
15 WATTS
MARKING
DIAGRAMS
4
3
4
DPAK
CASE 369C
STYLE 1
AYWW
J3xxG
Vdc
1
Vdc
Adc
Adc
W
W/°C
W
W/°C
°C
2
DPAK−3
CASE 369D
STYLE 1
3
A
Y
WW
xx
G
YWW
J3xxG
= Site Code
= Year
= Work Week
= 1, 1C, 2, or 2C
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient*
Lead Temperature for Soldering Purposes
Symbol
R
qJC
R
qJA
T
L
Max
8.3
80
260
Unit
°C/W
°C/W
°C
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
©
Semiconductor Components Industries, LLC, 2011
February, 2011
Rev. 8
1
Publication Order Number:
MJD31/D
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