1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 8 and 9.
ELECTRICAL CHARACTERISTICS
Rating
Maximum Instantaneous Forward Voltage (Note 2)
(I
F
= 0.1 A)
(I
F
= 1.0 A)
(I
F
= 2.0 A)
Maximum Instantaneous Reverse Current (Note 2)
(V
R
= 5.0 V)
(V
R
= 10 V)
2. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2%.
Symbol
V
F
V
F
Value
T
J
= 25°C
0.455
0.530
0.595
T
J
= 25°C
0.5
1.0
T
J
= 100°C
0.360
0.455
0.540
T
J
= 100°C
300
500
Unit
V
V
I
R
mA
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
T
J
= 150°C
T
J
= 100°C
T
J
= 25°C
T
J
= -40°C
1.0
10
T
J
= 150°C
T
J
= 100°C
1.0
T
J
= 25°C
0.1
0.2
0.4
0.6
0.8
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.1
0.2
0.4
0.6
0.8
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRM110E
100E-3
IR, REVERSE CURRENT (AMPS)
10E-3
1E-3
T
J
= 150°C
T
J
= 100°C
10E-6
1E-6
T
J
= 25°C
0
2.5
5
7.5
10
100E-3
10E-3
1E-3
T
J
= 150°C
T
J
= 100°C
100E-6
I R, MAXIMUM REVERSE CURRENT (AMPS)
100E-6
10E-6
1E-6
T
J
= 25°C
100E-9
10E-9
100E-9
10E-9
0
2.5
5
7.5
10
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
PFO , AVERAGE POWER DISSIPATION (WATTS)
1.8
I O , AVERAGE FORWARD CURRENT (AMPS)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
25
45
65
85
105
125
SQUARE WAVE
I
pk
/I
o
=
p
I
pk
/I
o
= 5
I
pk
/I
o
= 10
I
pk
/I
o
= 20
dc
FREQ = 20 kHz
0.7
0.6
I
pk
/I
o
=
p
0.5
I
pk
/I
o
= 5
0.4
I
pk
/I
o
= 10
0.3
I
pk
/I
o
= 20
0.2
0.1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
SQUARE
WAVE
dc
145
165
1.4
1.6
T
L
, LEAD TEMPERATURE (°C)
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
1000
C, CAPACITANCE (pF)
T
J
= 25°C
100
10
0
1
2
3
4
5
6
7
8
9
10
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
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3
MBRM110E
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
50%
20%
0.1
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.001
0.00001
0.01
0.0001
0.001
0.01
T, TIME (s)
0.1
1.0
10
100
Figure 8. Thermal Response Junction to Lead
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
50%
20%
0.1
10%
5.0%
0.01
2.0%
Rtjl(t) = Rtjl*r(t)
1.0%
0.001
0.00001
0.0001
0.001
0.01
0.1
T, TIME (s)
1.0
10
100
1,000
Figure 9. Thermal Response Junction to Ambient
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4
MBRM110E
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE D
−A−
S
C
J
F
0.08 (0.003)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
M
T B
S
C
S
−B−
K
TERM. 1
TERM. 2
R
J
H
−T−
L
DIM
A
B
C
D
F
H
J
K
L
R
S
D
0.08 (0.003)
M
T B
S
C
S
SOLDERING FOOTPRINT*
0.635
0.025
0.762
0.030
2.67
0.105
2.54
0.100
1.27
0.050
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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