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MBRM110E_06

Description
1 A, 10 V, SILICON, SIGNAL DIODE, DO-216AA
Categorysemiconductor    Discrete semiconductor   
File Size104KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

MBRM110E_06 Overview

1 A, 10 V, SILICON, SIGNAL DIODE, DO-216AA

MBRM110E_06 Parametric

Parameter NameAttribute value
Number of terminals1
Number of components1
Processing package descriptionLEAD FREE, MICRO MINIATURE, PLASTIC, CASE 457-04, POWERMITE-2
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingMATTE Tin
Terminal locationsingle
Packaging MaterialsPlastic/Epoxy
CraftsmanshipSCHOTTKY
structuresingle
Shell connectionCATHODE
Diode component materialssilicon
Diode typeSignal diode
Maximum repetitive peak reverse voltage10 V
Maximum average forward current1 A
MBRM110E
Surface Mount
Schottky Power Rectifier
POWERMITE
®
Power Surface Mount Package
The Schottky
employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite
®
has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles,
<
1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “ORing” of multiple supply
voltages and any other application where performance and size are
critical.
Features
http://onsemi.com
Powermite
®
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES, 10 VOLTS
ANODE
CATHODE
Low I
R
Extends Battery Life
Low Profile
Maximum Height of 1.1 mm
Small Footprint
Footprint Area of 8.45 mm
2
150°C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
Pb−Free Packages are Available
Mechanical Characteristics:
POWERMITE
CASE 457
PLASTIC
MARKING DIAGRAM
M
1E1G
Powermite
®
is JEDEC Registered as D0−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
M
1E1
G
= Date Code
= Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
MBRM110ET1
Package
Shipping
POWERMITE 3000/Tape & Reel
MBRM110ET1G POWERMITE 3000/Tape & Reel
(Pb−Free)
MBRM110ET3
POWERMITE 12000/Tape & Reel
MBRM110ET3G POWERMITE 12000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
September, 2006
Rev. 2
1
Publication Order Number:
MBRM110E/D

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Index Files: 251  1117  1371  2195  1997  6  23  28  45  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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