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MGFL48V1920_11

Description
1.9-2.0 GHz BAND / 60W
File Size316KB,5 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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MGFL48V1920_11 Overview

1.9-2.0 GHz BAND / 60W

< L/S band internally matched power GaAs FET >
MGFL48V1920
1.9 – 2.0 GHz BAND / 60W
DESCRIPTION
The MGFL48V1920 is a 60W push-pull type GaAs power FET
especially designed for use in 1.9 - 2.0 GHz band amplifiers.
The hermetically sealed metal-ceramic package guarantees
high reliability.
FEATURES
Push-pull configuration
High output power
Pout=60W (TYP.) @f=1.9 - 2.0GHz
High power gain
GLP=11.5dB (TYP.) @f=1.9 - 2.0GHz
High power added efficiency
P.A.E.=45% (TYP.) @f=1.9 - 2.0GHz
APPLICATION
QUALITY
IG
item 01 : 1.9 - 2.0 GHz band power amplifier
RECOMMENDED BIAS CONDITIONS
VDS=12V
ID=4.0A
RG=20ohm for each gate
Keep Safety first in your circuit designs!
Absolute maximum ratings
Symbol
VGDO
VGSO
PT *1
Tch
Tstg
(Ta=25C)
Parameter
Gate to drain breakdown voltage
Gate to source breakdown voltage
Total power dissipation
Cannel temperature
Storage temperature
Ratings
-20
-10
10
175
-65 to +175
Unit
V
V
W
C
C
*1 : Tc=25C
Mitsubishi Electric Corporation puts the maximum
effort into making semiconductor products better
and more reliable , but there is always the
possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal
injury , fire or property damage. Remember to give
due consideration to safety when making your
circuit designs , with appropriate measure such
as (I) placement of substitutive , auxiliary circuits ,
(ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
Electrical characteristics
Symbol
VGS(off)
P2dB
GLP
ID
P.A.E.
Rth(ch-c) *2
(Ta=25C)
Parameter
Gate to source cut-off voltage
Output power at 2dB gain compression
Test conditions
Min.
VDS=3V,ID=17.3mA
VDS=12V,ID(RF off)=4.0A
f=1.9 - 2.0GHz
-1
47
10
-
-
delta Vf method
-
Limits
Typ.
-
48
11.5
11
45
1.0
Unit
Max.
-4
-
-
15
-
1.4
V
dBm
dB
A
%
C/W
Linear Power Gain
Drain current
Power added efficiency
Thermal resistance
*2 :Channel-case
Publication Date : Apr., 2011
1

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