[size=4] This is a real sample! The model number of the released chip should be: [color=#000][font=Arial, sans-serif]MSP430FR5969. The current chip model still starts with: XMS, indicating that it is ...
MCU, MSP430F5324 I used P6.1 and P6.2 to simulate SPI, but now I find the speed is not fast enough. I have tested the hardware SPI (P2.7 and P3.3) and it seems to work fine. Is there any way to solve ...
I am currently using the Linux 2.6.29 kernel. There is an SPI driver in drivers/SPI, but after compiling the kernel, I found that no SPI device has been loaded. How can I use its own driver function?...
[color=#333333][font=微软雅黑, arial]Does anyone know if the first one can be used? Is the second one necessary? By the way, I would like to ask for a control class prediction. The component list has been...
Does anyone have a book on VHDL testbenches? I need to test a large project. I have read some materials and wonder if there is a classic book on this subject! Thank you in advance!...
1. We want to use TI's LMZ31710RVQT, but this chip itself has the requirement of connecting two grounds, but our circuit board has both analog and digital circuits. Please refer to the above figure to...
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
Multi-touch mobile phone
Multi-touch is a system that can respond to multiple touches on the screen at the same time. Multi-touch phones are divided into capacitive and resistive types. Capaci...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
According to foreign media reports, researchers at the University of Surrey have developed an artificial intelligence system that can accurately locate the location of equipment in densely populate...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
HTTP is the abbreviation of Hypertext Transfer Protocol. It is an application protocol based on TCP/IP communication protocol used to transmit HTML and image files. It is an application-level objec...[Details]
Shanghai, China, August 21, 2025 –
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the launch of the TLX9161T
, an automotive photorelay in a compact SO12L-T pa...[Details]
introduction
With the development of the information superhighway and the internet, broadcast television has become increasingly widespread worldwide. Television information has emerged in var...[Details]
On August 20, Reuters reported that two sources revealed that U.S. Commerce Secretary Howard Lutnick is exploring the possibility of using CHIPS Act funds in exchange for equity stakes in chip manu...[Details]
The power transmission system between a car's engine and drive wheels is called its drivetrain. It ensures the necessary traction and speed under various driving conditions, and coordinates these t...[Details]
Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]