MSP430F4491IPZ datasheet, PDF - EEWORLD Datasheet

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MSP430F4491IPZ: Description16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，79 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430F4491IPZ Overview

16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85

MSP430F4491IPZ Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFP
package instruction	LFQFP, QFP100,.63SQ,20
Contacts	100
Reach Compliance Code	compli
Factory Lead Time	6 weeks
Samacsys Descripti	MIXED SIGNAL MICROCONTROLLER
Has ADC	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ
Address bus width
bit size	16
boundary scan	YES
CPU series	MSP430
maximum clock frequency	8 MHz
DAC channel	NO
DMA channel	NO
External data bus width
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PQFP-G100
JESD-609 code	e4
length	14 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels
Number of external interrupt devices
Number of I/O lines	48
Number of serial I/Os	2
Number of terminals	100
Number of timers	7
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	2048
RAM (number of words)	2
rom(word)	61440
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	8 MHz
Maximum slew rate	0.56 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

MSP430F4491IPZ Related Products

	MSP430F4491IPZ	MSP430F4481IPZ	MSP430F4491IPZR
Description	16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85	16-Bit Ultra-Low-Power MCU, 48kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85	16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Parts packaging code	QFP	QFP	QFP
package instruction	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20
Contacts	100	100	100
Reach Compliance Code	compli	compli	compli
Factory Lead Time	6 weeks	1 week	1 week
Has ADC	YES	YES	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ	ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ	ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ
bit size	16	16	16
boundary scan	YES	YES	YES
CPU series	MSP430	MSP430	MSP430
maximum clock frequency	8 MHz	8 MHz	8 MHz
DAC channel	NO	NO	NO
DMA channel	NO	NO	NO
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e4	e4	e4
length	14 mm	14 mm	14 mm
low power mode	YES	YES	YES
Humidity sensitivity level	3	3	3
Number of I/O lines	48	48	48
Number of serial I/Os	2	2	2
Number of terminals	100	100	100
Number of timers	7	7	7
On-chip data RAM width	8	8	8
On-chip program ROM width	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260
power supply	2/3.3 V	2/3.3 V	2/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	2048	2048	2048
RAM (number of words)	2	2	2
rom(word)	61440	49152	61440
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.6 mm	1.6 mm
speed	8 MHz	8 MHz	8 MHz
Maximum slew rate	0.56 mA	0.56 mA	0.56 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V
Nominal supply voltage	3 V	3 V	3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	-	1	1

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