450½
MOSFET
50A 450
½
500V
PD7M441H/440H
108.0
PD7M441H
P2H7M441H
P2H7M441H/440H
108.0
PD7M440H
P2H7M440H
質量
Approximate Weight :220g
■
最大定格
Maximum Ratings
質量
Approximate Weight :220g
単½
耐 圧・クラス
Grade
PD7M441H/P2H7M441H PD7M440H/P2H7M440H Unit
450
500
V
V
GS
=0V
±20
50(Tc=25℃)
35(Tc=25℃)
100(Tc=25℃)
350(Tc=25℃)
−40∼+150℃
−40∼+125℃
2000
端子
-
ベース間,AC1 分間
Terminals to Base, AC 1 min .
3.0(本½取付 Module Base to Heat sink)
2.0(ネジ端子部 Bus bar to Main Terminals)
V
A
A
W
℃
℃
V
N・m
項
Rating
ドレイン・½ース間電圧
Drain-Source Voltage
目
記 号
Symbol
V
DSS
V
GSS
ゲート・½ース間電圧
Gate-Source Voltage
ドレイン電流(連続)
Continuous Drain Current
Duty=50%
D.C.
I
D
I
DM
P
D
T
jw
T
stg
V
iso
F
tor
パルスドレイン電流
Pulsed Drain Current
全損失
Total Power Dissipation
動½接合温度範囲
Operating Junction Temperature Range
保存温度範囲
Storage Temperature Range
絶縁耐圧
RMS Isolation Voltage
締付トルク
Mounting Torque
1
■電気的特性 Electrical Characteristics(@T
C
=25℃ unless otherwise noted)
項 目
Characteristic
ドレイン遮断電流
Zero Gate Voltage Drain Current
ゲート・½ース間しきい値電圧
Gate-Source Threshold Voltage
ゲート・½ース間漏れ電流
Gate-Source Leakage Current
ドレイン・½ース間オン抵抗
(MOSFET部)
Static Drain-Source On-Resistance
ドレイン・½ース間オン電圧
Drain-Source On-Voltage
順伝達コンダクタンス
Forward Transconductance
入力容量
Input Capacitance
出力容量
Output Capacitance
帰還容量
Reverse Transfer Capacitance
ターン・オン遅延時間
Turn-On Delay Time
上昇時間
Rise Time
ターン・オン遅延時間
Turn-Off Delay Time
下降時間
Fall Time
記号
Symbol
I
DSS
V
GS
(th)
I
GSS
r
DS
(on)
V
DS
(on)
g
fg
C
iss
C
oss
C
rss
t
(on)
d
t
r
t
(off)
d
t
f
V
DD
=1/2V
DSS
I
D
=25A
V
GS
=−5V, +10V
R
G
=7Ω
V
GS
=0V
V
DS
=25V
f=1MHz
条 件
Condition
V
DS
=V
DSS
, V
GS
=0V
T
j
=125℃, V
DS
=V
DSS
, V
GS
=0V
V
DS
=V
GS
, I
D
=1mA
V
GS
=±20V, V
DS
=0V
V
GS
=10V, I
D
=25A
V
GS
=10V, I
D
=25A
V
DS
=15V, I
D
=25A
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
単½
Unit
mA
V
μ
A
mΩ
V
S
nF
nF
nF
ns
ns
ns
ns
─
─
2
─
─
─
─
─
─
─
─
─
─
─
─
─
3.1
─
110
3.2
45
9.0
1.7
0.32
120
80
240
50
1
4
4
1
120
3.4
─
─
─
─
─
─
─
─
■内部ダイオード定格・特性 Source-Drain Diode Ratings and Characteristics(@T
C
=25℃ unless otherwise noted)
項 目
Characteristic
½ース電流(連続)
Continuous Source Current
パルス½ース電流
Pulsed Source Current
ダイオード順電圧
Diode Forward Voltage
逆回復時間
Reverse Recovery Time
逆回復電荷
Reverse Recovery Charge
記号
Symbol
I
S
I
SM
V
SD
t
rr
Q
r
I
S
=50A
I
S
=50A
−di
S
/dt=100A/ s
μ
D. C.
条 件
Condition
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
単½
Unit
A
A
V
ns
μ
C
─
─
─
─
─
─
─
─
100
0.15
35
100
1.9
─
─
■熱抵抗特性 Thermal Characteristics
項 目
Characteristic
熱抵抗(接合部−ケース間)
Thermal Resistance, Junction to Case
接触熱抵抗(ケース−冷却フィン間)
Thermal Resistance, Case to Heatsink
記号
Symbol
R
th
(j-c)
R
th
(c-f)
MOSFET
Diode
サーマルコンパウンド塗布
Mounting surface flat, smooth, and greased
条 件
Condition
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
単½
Unit
─
─
─
─
─
─
0.36
2.0
0.1
℃/W
─ 311 ─
■定格・特性曲線
Fig. 1 Typical Output Characteristics
T
C
=25℃ 250μs Pulse Test
Fig. 2 Typical Drain-Source On-Voltage
Fig. 2
Vs. Gate-Source Voltage
Fig. 3 Typical Drain-Source On Voltage
Fig. 3
Vs. Junction Temperature
80
8
DRAIN TO SOURCE ON VOLTAGE V
DS
(on)(V)
T
C
=25℃ 250μs Pulse Test
16
DRAIN TO SOURCE ON VOLTAGE V
DS
(on)(V)
V
GS
=10V 250μs Pulse Test
I
D
=50A
10V
6V
I
D
=50A
DRAIN CURRENT I
D
(A)
60
6
12
40
4
25A
8
25A
V
GS
=5V
20
2
15A
4
15A
0
0
4V
2
4
6
8
10
DRAIN TO SOURCE VOLTAGE V
DS
(V)
12
0
0
4
8
12
GATE TO SOURCE VOLTAGE V
GS
(V)
16
0
-40
0
40
80
120
JUNCTION TEMPERATURE T
j
(
)
℃
160
Fig. 4 Typical Capacitance
Fig. 4
Vs. Drain-Source Voltage
Fig. 5 Typical Gate Charge
Fig. 5
Vs. Gate-Source Voltage
V
GS
=0V f=1kHz
Fig. 6 Typical Switching Time
Fig. 6
Vs. Series Gate impedance
I
D
=35A
18
16
V
DD
= 100V
250V
400V
10
I
D
=25A V
DD
=250V T
C
=25℃ 80μs Pulse Test
15
CAPACITANCE C (nF)
GATE TO SOURCE VOLTAGE V
GS
(V)
5
SWITCHING TIME t (
μ
s)
12
12
C
iss
2
1
9
8
6
C
oss
0.5
toff
ton
4
3
C
rss
0.2
0
1
2
5
10
20
50
DRAIN TO SOURCE VOLTAGE V
DS
(V)
100
0
0
80
160
240
320
400
TOTAL GATE CHRAGE Q
g
(nC)
480
0.1
2
5
10
20
50
100
SERIES GATE IMPEDANCE R
G
(
Ω
)
200
Fig. 7 Typical Switching Time
Fig. 7
Vs. Drain Current
Fig. 8 Typical Source-Drain Diode Forward
Fig. 8
Characteristics
Fig. 9 Typical Reverse Recovery Characteristics
I
S
=50A I
S
=25A T
j
=150℃
1000
R
G
=7Ω V
DD
=250V T
C
=25℃ 80μs Pulse Test
120
250μs Pulse Test
500
REVERSE RECOVERY TIME t
rr
(ns)
REVERSE CURRENT I
R
(A)
500
SWITCHING TIME t (ns)
t
d
(off)
100
SOURCE CURRENT I
S
(A)
200
t
rr
200
t
d
(on)
80
100
100
t
r
t
f
60
T
j
=125℃
T
j
=25℃
50
I
R
50
40
20
20
10
20
10
1
2
5
10
20
DRAIN CURRENT I
D
(A)
50
100
0
0
0.3
0.6
0.9
1.2
1.5
SOURCE TO DRAIN VOLTAGE V
SD
(V)
2
10
0
5
2
10
-1
5
2
1.8
5
0
100
200
300
400
-dis/dt (A/
μ
s)
500
600
T
C
=25℃ T
j
=150℃MAX Single Pulse
200
Operation in this area
is limited by R
DS
(on)
100
10μs
50
DRAIN CURRENT I
D
(A)
100μs
NORMALIZED TRANSIENT
THERMAL IMPEDANCE
[r
th(j-c)
/ R
th(j-c)
]
Fig. 10 Maximum Safe Operating Area
Fig. 11-1
Normalized Transient Thermal
impedance(MOSFET)
20
10
5
1ms
Per Unit Base
R
th(j-c)
=0.36℃/W
1 Shot Pulse
M
O
S
F
E
T
モ
ジ
ュ
ー
ル
10
-2 -5
10
10
-4
10
-3
10
-2
10
-1
PULSE DURATION t (s)
10
0
10
1
NORMALIZED TRANSIENT
THERMAL IMPEDANCE
[r
th(j-c)
/ R
th(j-c)
]
2
1
10ms
DC
Fig. 11-2
Normalized Transient Thermal
impedance(DIODE)
2
10
0
5
2
10
-1
5
2
10
-2 -5
10
10
-4
10
-3
10
-2
10
-1
PULSE DURATION t (s)
Per Unit Base
R
th(j-c)
=2.0℃/W
1 Shot Pulse
0.5
0.2
−441H −440H
100 200 500 1000
1
2
5
10 20
50
DRAIN TO SOURCE VOLTAGE V
DS
(V)
10
0
10
1
─ 312 ─