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2MBI300U4N-170-50

Description
IGBT MODULE
File Size481KB,6 Pages
ManufacturerFUJI
Websitehttp://www.fujielectric.co.jp/eng/fdt/scd/
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2MBI300U4N-170-50 Overview

IGBT MODULE

2MBI300U4N-170-50
IGBT MODULE (U series)
1700V / 300A / 2 in one package
Features
High speed switching
Voltage drive
Low Inductance module structure
IGBT Modules
Applications
Inverter for Motor Drive
AC and DC Servo Drive Amplifier
Uninterruptible Power Supply
Industrial machines, such as Welding machines
Absolute Maximum Ratings (at Tc=25°C unless otherwise specified)
Items
Collector-Emitter voltage
Gate-Emitter voltage
Symbols
V
CES
V
GES
Ic
Collector current
Icp
-Ic
-Ic pulse
Pc
Tj
Tstg
Conditions
Tc=25°C
Tc=80°C
Tc=25°C
Tc=80°C
Maximum ratings
1700
±20
450
300
900
600
300
600
1385
150
-40 to +125
3400
3.5
4.5
Units
V
V
Maximum Ratings and Characteristics
Continuous
1ms
1ms
1 device
A
Collector power dissipation
Junction temperature
Storage temperature
between terminal and copper base (*1)
Isolation voltage
V
iso
between thermistor and others (*2)
Mounting (*3)
Screw torque
-
Terminals (*4)
W
°C
VAC
Nm
AC : 1min.
Note *1: All terminals should be connected together when isolation test will be done.
Note *2: Two thermistor terminals should be connected together, each other terminals should be connected together and shorted to base plate when isolation test will be done.
Note *3: Recommendable value : Mounting : 2.5-3.5 Nm (M5) Note *4: Recommendable value : Terminals : 3.5-4.5 Nm (M6)
Electrical characteristics (at Tj= 25°C unless otherwise specified)
Items
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time
Lead resistance, terminal-chip (*5)
Thermistor
Resistance
B value
Symbols
I
CES
I
GES
V
GE (th)
V
CE (sat)
(terminal)
V
CE (sat)
(chip)
Cies
ton
tr
tr (i)
toff
tf
V
F
(terminal)
V
F
(chip)
trr
R lead
R
B
Conditions
V
GE
= 0V, V
CE
= 1700V
V
CE
= 0V, V
GE
= ±20V
V
CE
= 20V, I
C
= 300mA
V
GE
= 15V
I
C
= 300A
V
CE
= 10V, V
GE
= 0V, f = 1MHz
V
CC
= 900V
I
C
= 300A
V
GE
= ±15V
R
G
= 1.5Ω
V
GE
= 0V
I
F
= 300A
I
F
= 300A
T=25°C
T=100°C
T=25/50°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Characteristics
min.
typ.
max.
-
-
3.0
-
-
600
4.5
6.5
8.5
-
2.70
2.90
-
3.10
-
-
2.30
2.45
-
2.65
-
-
28
-
-
0.62
1.20
-
0.39
0.60
-
0.05
-
-
0.55
1.50
-
0.09
0.30
-
2.10
2.40
-
2.30
-
-
1.80
1.95
-
2.00
-
-
0.18
0.6
-
1.00
-
-
5000
-
465
495
520
3305
3375
3450
Units
mA
nA
V
V
nF
µs
Inverter
V
µs
mΩ
K
Note *5: Biggest internal terminal resistance among arm.
Thermal resistance characteristics
Items
Thermal resistance (1device)
Contact thermal resistance (1device) (*6)
Symbols
Rth(j-c)
Rth(c-f)
Conditions
IGBT
FWD
with Thermal Compound
Characteristics
min.
typ.
max.
-
-
0.09
-
-
0.15
-
0.0167
-
Units
°C/W
Note *6: This is the value which is defined mounting on the additional cooling fin with thermal compound.
1

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