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TNFLA1A336MTRXF

Description
CAPACITOR, TANTALUM, SOLID POLYMER, POLARIZED, 10V, 33uF, SURFACE MOUNT, 1206, CHIP, LEAD FREE
CategoryPassive components    capacitor   
File Size56KB,2 Pages
ManufacturerHoly Stone
Websitehttp://www.holystonecaps.com
Environmental Compliance  
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TNFLA1A336MTRXF Overview

CAPACITOR, TANTALUM, SOLID POLYMER, POLARIZED, 10V, 33uF, SURFACE MOUNT, 1206, CHIP, LEAD FREE

TANTALUM ELECTROLYTIC CAPACITORS
TNF Series
(High Performance Polymer type Chip Tantalum
Capacitor with Face-down Type TNF series)
Product
specifications
TNF
Test conditions JIS C5101-1:1998
Features
• A high function and reliability are achieved by uniting the
electroconductive polymer and the lower electrode structure.
• This type reduces ESR be using high performance polymer
based on our original manufacturing process.
• This type is suitable for high-density implementation such as the
multimedia connection.
Operating temperature range –55°C ~ +105°C
Rated voltage
Surge voltage
Derated voltage
Capacitance
Capacitance tolerance
DC2.5 ~ 10V
DC3V ~ 13V
DC1.6 ~ 6.3V
10 ~ 100µF
±20%
85°C
85°C
(105°C)
120Hz
120Hz
Product code: (Example) TNF type LA case 10V 33
µF±20%,
ESR 200mΩ
TNF LA 1A 336 M T R X F
Type of
series
Case size code
Lead-free solder plating
Specific product code
Packing polarity code
With or without taping
Capacitance tolerance code(M :
±
20%)
Capacitance code
Rated voltage code
Leakage current
Refer to standard product table
Outline of drawings and dimensions
tanδ
0.1 or less
120Hz
N7Aa
ESR
H
L
W
LM
case
500mΩ
MAX
LP
case
200mΩ,500mΩ
MAX
100kHz
LA
case
200mΩ,500mΩ
MAX
Charge a surge voltage through a
protective resistor of 33Ω for 30
seconds and discharge it for 5
minutes and 30 seconds at 85°C.
Repeat this operation 1000 times.
a
l
l
C/C ±20% or less
Surge withstanding
tanδ
voltage
LC
Specified initial value or less
300% or less Specified initial value or less
Specified initial value
C/C
0.10
–55
105
-20∼0% 0∼+30%
0.14
Dimensions
Case
code
LM
LP
LA
L
±0.1
(Unit : mm)
tanδ
Value shown table
W
±0.1
Case size
H
±0.1
R
±0.1
0.8
0.9
0.9
0.5
0.5
0.8
a
±0.1
1.6
2.0
3.2
0.85
1.25
1.60
0.65
0.90
1.20
Temperature
characteristics
Measure the specified
characteristics in each stage.
or less
LC
Refer to
standard
product table
1CV
or
30µA or less
C/C ±20% or less
Standard value and case size
Capacitance
μF
10
15
22
33
47
68
100
Code
106
156
226
336
476
686
107
2.5
0E
Rated voltage (V.DC)
4
6.3
0G
0J
LM
LP
LP
LP
LA
LA
LA
LA
10
1A
LP
Solder heat
resistance
tanδ
LC
Specified initial value or less
300% or less Specified initial value or less
Reflow
Board surface peak temperature:
250°C 5S
217°C or more: within 90 sec.
C/C +30% ~ -20% or less
Moisture resistance
no load
tanδ
LC
Specified initial value or less
300% or less Specified initial value or less
C/C ±20% or less
High-temperature
load
tanδ
LC
Specified initial value or less
300% or less Specified initial value or less
C/C ±20% or less
Thermal shock
tanδ
LC
Failure rate
Specified initial value or less
300% or less Specified initial value or less
Leave at 40°C and 90 to
95%RH for 500 hours.
85°C. The rated voltage is
applied through a protective
resistor of 3Ω for 1000 hours.
Leave at -55°C, normal
temperature, 85°C, and normal
temperature for 30 min., 15 min.,
30 min., and 15 min. Repeat this
operation 5 times running.
85°C. The rated voltage is applied
(through a protective resistor of 1
Ω/V).
1% / 1000hrs
129
Hitachi AIC Inc.

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