Standard SRAM, 1KX4, 85ns, CMOS, PDIP18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi (Renesas ) |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 85 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T18 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 18 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| HM6148LP-6 | HM6148P | |
|---|---|---|
| Description | Standard SRAM, 1KX4, 85ns, CMOS, PDIP18 | Standard SRAM, 1KX4, 70ns, CMOS, PDIP18 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Hitachi (Renesas ) | Hitachi (Renesas ) |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 85 ns | 70 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 |
| memory density | 4096 bit | 4096 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 |
| Number of terminals | 18 | 18 |
| word count | 1024 words | 1024 words |
| character code | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 1KX4 | 1KX4 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 0.08 mA | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |