GE28F008B3TA70 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> GE28F008B3TA70

GE28F008B3TA70: DescriptionFlash, 1MX8, 70ns, PBGA46, VFBGA-46; Categorystorage storage; File Size609KB，71 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

Download Datasheet Parametric Compare View All

GE28F008B3TA70 Overview

Flash, 1MX8, 70ns, PBGA46, VFBGA-46

GE28F008B3TA70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	BGA
package instruction	VFBGA-46
Contacts	46
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	70 ns
Other features	TOP BOOT BLOCK
startup block	TOP
command user interface	YES
Data polling	NO
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PBGA-B46
JESD-609 code	e0
length	7.91 mm
memory density	8388608 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	8,15
Number of terminals	46
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA45,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3.6,3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	6.5 mm

Preview

Download Datasheet

View All

Intel

Advanced Boot Block Flash

Memory (B3)

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Datasheet

Product Features

•

Flexible SmartVoltage Technology

— 2.7 V – 3.6 V read/program/erase

— 12 V V

fast production programming

•

Intel

Flash Data Integrator Software

—Flash Memory Manager

—System Interrupt Manager

—Supports parameter storage, streaming

data (for example, voice)

•

1.65 V – .5 V or 2.7 V – 3.6 V I/O option

— Reduces overall system power

•

High Performance

— 2.7 V – 3.6 V: 70 ns max access time

•

Extended Cycling Capability

—Minimum 100,000 block erase cycles

•

Optimized Block Sizes

— Eight 8-KB blocks for data, top or

bottom locations

— Up to 127 x 64-KB blocks for code

•

Automatic Power Savings Feature

—Typical I

CCS

after bus inactivity

•

Standard Surface Mount Packaging

—48-Ball CSP packages

—40-Lead and 48-Lead TSOP packages

•

Block Locking

— V

-level control through Write Protect

WP#

•

Density and Footprint Upgradeable for

common package

—8-, 16-, 32-, and 64-Mbit densities

•

Low Power Consumption

— 9 mA typical read current

•

ETOX™ VIII (0.13

µm)

Flash

Technology

—16-Mbit and 32-Mbit densities

•

Absolute Hardware-Protection

— V

= GND option

— V

lockout voltage

•

ETOX™ VII (0.18

µm)

Flash Technology

—16-, 32-, and 64-Mbit densities

•

Extended Temperature Operation

— –40 °C to +85 °C

•

ETOX ™ VI (0.25µm) Flash Technology

—8-, 16-, and 32-Mbit densities

•

Automated Program and Block Erase

— Status registers

•

Bo not use the x8 option for new designs

The Intel

Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13

µm

and 0.18

µm

technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is

available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is

available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about

this product family, see the Intel website:

http://www.intel.com/design/flash.

Notice:

This specification is subject to change without notice. Verify with your local Intel sales

office that you have the latest datasheet before finalizing a design.

Order Number: 290580, Revision: 020

18 Aug 2005

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Contents

1.0 Introduction

............................................................................................................................... 7

1.1

1.2

Nomenclature ....................................................................................................................... 7

Conventions .......................................................................................................................... 8

2.0 Functional Overview

.............................................................................................................. 8

3.0 Functional Overview

.............................................................................................................. 9

3.1

3.2

Architecture Diagram .......................................................................................................... 10

Memory Maps and Block Organization ............................................................................... 11

3.2.1 Parameter Blocks .................................................................................................. 11

3.2.2 Main Blocks ........................................................................................................... 11

3.2.3 4-Mbit, 8-Mbit, 16-Mbit, 32-Mbit, and 64-Mbit Word-Wide Memory Maps ............. 11

3.2.4 4-Mbit, 8-Mbit, and 16-Mbit Byte-Wide Memory Maps........................................... 20

4.0 Package Information

............................................................................................................ 24

4.1

4.2

4.3

mBGA* and Very Thin Profile Fine Pitch Ball Grid Array (VF BGA) Package .................... 24

TSOP Package ................................................................................................................... 25

Easy BGA Package ............................................................................................................ 26

5.0 Pinout and Signal Descriptions

....................................................................................... 27

5.1

5.2

Signal Pinouts ..................................................................................................................... 27

5.1.1 40-Lead and 48-Lead TSOP Packages ................................................................. 27

Signal Descriptions ............................................................................................................. 30

6.0 Maximum Ratings and Operating Conditions

...........................................................32

6.1

6.2

Absolute Maximum Ratings ................................................................................................ 32

Operating Conditions .......................................................................................................... 33

7.0 Electrical Specifications

..................................................................................................... 34

7.1

7.2

DC Current Characteristics .................................................................................................34

DC Voltage Characteristics.................................................................................................36

8.0 AC Characteristics

................................................................................................................ 37

8.1

8.2

8.3

8.4

8.5

AC Read Characteristics .................................................................................................... 37

AC Write Characteristics..................................................................................................... 41

Erase and Program Timing .................................................................................................45

AC I/O Test Conditions ....................................................................................................... 46

Device Capacitance ............................................................................................................ 46

9.0 Power and Reset Specifications

.....................................................................................47

9.1

Power-Up/Down Characteristics ......................................................................................... 47

9.1.1 RP# Connected to System Reset .......................................................................... 47

9.1.2 V

, V

PP,

and RP# Transitions..............................................................................47

Reset Specifications ........................................................................................................... 48

Power Supply Decoupling................................................................................................... 49

9.2

9.3

Datasheet

Intel

Advanced Boot Block Flash Memory (B3)

Order Number: 290580, Revision: 020

18 Aug 2005

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

9.4

Power Consumption ........................................................................................................... 49

9.4.1 Active Power.......................................................................................................... 49

9.4.2 Automatic Power Savings (APS) ........................................................................... 49

9.4.3 Standby Power ...................................................................................................... 49

9.4.4 Deep Power-Down Mode....................................................................................... 50

10.0 Operations Overview

........................................................................................................... 50

10.1

Bus Operations ................................................................................................................... 51

10.1.1 Read ...................................................................................................................... 51

10.1.2 Output Disable ....................................................................................................... 52

10.1.3 Standby.................................................................................................................. 52

10.1.4 Deep Power-Down / Reset .................................................................................... 52

10.1.5 Write ...................................................................................................................... 53

11.0 Operating Modes

................................................................................................................... 53

11.1

11.2

11.3

11.4

11.5

Read Array.......................................................................................................................... 54

Read Identifier .................................................................................................................... 56

Read Status Register.......................................................................................................... 56

11.3.1 Clearing the Status Register.................................................................................. 57

Program Mode .................................................................................................................... 57

11.4.1 Suspending and Resuming Programming ............................................................. 58

Erase Mode ........................................................................................................................ 58

11.5.1 Suspending and Resuming Erase ......................................................................... 59

12.0 Block Locking

......................................................................................................................... 62

12.1

12.2

WP# = V

for Block Locking............................................................................................... 62

WP# = V

for Block Unlocking........................................................................................... 62

= V

for Complete Protection...................................................................................... 63

13.0 V

Program and Erase Voltages

................................................................................... 63

13.1

14.0 Additional Information

........................................................................................................ 63

Appendix A

Appendix B

Appendix C

Write State Machine Current/Next States

................................................. 64

Program and Erase Flowcharts

.................................................................... 66

Ordering Information

......................................................................................... 70

18 Aug 2005

Intel

Advanced Boot Block Flash Memory (B3)

Order Number: 290580, Revision: 020

Datasheet

GE28F008B3TA70 Related Products

	GE28F008B3TA70	JS28F160B3BD70	JS28F160B3TA70	GE28F160B3BC90	PH28F160B3BD70	PH28F160B3TD70
Description	Flash, 1MX8, 70ns, PBGA46, VFBGA-46	Flash, 1MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48	Flash, 1MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48	Flash, 1MX16, 90ns, PBGA48, VFBGA-48	Flash, 1MX16, 70ns, PBGA48, LEAD FREE, VFBGA-48	Flash, 1MX16, 70ns, PBGA48, LEAD FREE, VFBGA-48
Is it Rohs certified?	incompatible	conform to	conform to	incompatible	conform to	conform to
Parts packaging code	BGA	TSOP	TSOP	BGA	BGA	BGA
package instruction	VFBGA-46	12 X 20 MM, LEAD FREE, TSOP-48	12 X 20 MM, LEAD FREE, TSOP-48	VFBGA-48	LEAD FREE, VFBGA-48	LEAD FREE, VFBGA-48
Contacts	46	48	48	48	48	48
Reach Compliance Code	unknown	compli	compli	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	70 ns	70 ns	90 ns	70 ns	70 ns
Other features	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK
startup block	TOP	BOTTOM	TOP	BOTTOM	BOTTOM	TOP
command user interface	YES	YES	YES	YES	YES	YES
Data polling	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PBGA-B46	R-PDSO-G48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e0	e3	e3	e0	e1	e1
length	7.91 mm	18.4 mm	18.4 mm	7.286 mm	7.286 mm	7.286 mm
memory density	8388608 bit	16777216 bi	16777216 bi	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of departments/size	8,15	8,31	8,31	8,31	8,31	8,31
Number of terminals	46	48	48	48	48	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX8	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	TSSOP	TSSOP	VFBGA	VFBGA	VFBGA
Encapsulate equivalent code	BGA45,6X8,30	TSSOP48,.8,20	TSSOP48,.8,20	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	240	260	260
power supply	1.8/3.6,3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1.2 mm	1.2 mm	1 mm	1 mm	1 mm
Department size	8K,64K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	GULL WING	GULL WING	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.5 mm	0.5 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	30	40	40
switch bit	NO	NO	NO	NO	NO	NO
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6.5 mm	12 mm	12 mm	6.964 mm	6.964 mm	6.964 mm

Recommended Resources

Relay fixed time overcurrent protection circuit a

Auto-coupling step-down starting circuit that can be controlled manually and automatically

Electric sewing machine circuit

Charging current adjustment circuit

Electrical power off switch

Digital Counting Demonstration Circuit

Discussion on the features of LPC800 series chips?: [size=4]According to NXP: [/size][color=black][font=宋体][size=10.5pt][hr][hr][hr][hr][hr][hr][hr][hr] [size=6][color=red]LPC800[/color][/size][size=6][color=red]has two innovative features[/color][/siz...; zhaojun_xf NXP MCU

I'm going to investigate what PLC software everyone is using now.: Hello everyone, I want to investigate which PLC software is most commonly used for drawing ladder diagrams? Siemens? Mitsubishi? Or Omron? Which age group uses which software? What kind of control is ...; freejames Embedded System

2416mmu: The data sheet of 2416 does not even have the MMU section. Can anyone tell me which manual I should refer to? The manual should at least explain the address of the relevant registers and the meaning o...; lyp260846137 Embedded System

MCU C language - sixteen ways of running lights (12): [b][color=#5E7384]This content is originally created by EEWORLD forum user [size=3]tiankai001[/size]. If you need to reprint or use it for commercial purposes, you must obtain the author's consent and...; tiankai001 51mcu

Comprehensive portable power management: ...; tlinzi Power technology

WinCE 5.0 minimum system cutting: At present, the system can mount and fail BINFS partitions normally. When there is only one file in the BINFS partition (for example, the NORFLASH driver), the system can boot and load the NORFLASH dr...; 自由女神 Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components