MOLDED POWER CHOKE COIL
1. PART NO. EXPRESSION :
PIB1003M SERIES
PIB1003 M 2R2MN-
(a)
(b)
(c)
(d) (e) (f)
(g)
(a) Series code
(b) Dimension code
(c) Type code
(d) Inductance code : 2R2 = 2.2uH
(e) Tolerance code : M = ± 20%, Y = ± 30%
(f) No coating
(g) Internal control number : 11 ~ 99
2. CONFIGURATION & DIMENSIONS :
A
C
D
2R2
YYXX.
B
E
Unit:m/m
A
11.0± 0.5
B
10.0± 0.3
C
2.8± 0.2
D
2.3± 0.3
E
3.0± 0.3
3. SCHEMATIC :
4. MATERIALS :
d
(a) Core : Alloy metal powder or equivalent
(b) Wire : Polyester wire or equivalent
(c) Solder Plating : 100% Pb free solder
(d) Ink : Halogen-free ketone
a
c
b
5. GENERAL SPECIFICATION :
a) Test Freq. : L : 100KHz/1V
b) Ambient Temp. : 25° C
c) Operating Temp. : -40° C to +125° C
d) Storage Temp. : -10° C to +40° C
e) Humidity Range : 50 ~ 60% RH (Product without taping)
f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately t of 40°C (keep 1min.)
g) Saturation Current (Isat) : Will cause L0 to drop 30% typical (keep quickly)
h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125° C under worst case operating conditions.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
Halogen
Free
HF
25.02.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
MOLDED POWER CHOKE COIL
8. RELIABILITY AND TEST CONDITION
PIB1003M SERIES
TEST CONDITION
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
CH16502, Agilent33420A Micro-Ohm Meter.
Irms(A) will cause the coil temperature rise
approximately T of 40°C without core loss
1. Applied the allowed DC current(keep 1min).
2. Temperature measured by digital surface thermometer
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
PERFORMANCE
Refer to standard electrical characteristics list
Saturation Current (Isat)
Reliability Test
High
Temperature Test
L30% typical
Electric specification should be satisfied
Isat(A) will cause Lo to drop
Temperature : 125± 2° C
Time : 1000± 12hrs
Measured at room temperature after placing for 2 to 3hrs
(MIL-PRF-27)
Low
Temperature Test
Thermal Shock
Temperature : -40± 2° C
Time :500± 12hrs
Measured at room temperature after placing for 2 to 3hrs
Conditions of 1 cycle.
Step
1
2
3
Temperature (° C)
-40+0/-2
Room Temperature
+125+2/-0
Times (min.)
15± 1
Within <0.2
15± 1
Total : 300 cycles
Measure at room temperature after placing for 2 to 3 hrs.
(AEC-Q200-REV C)
Humidity Resistance
Temperature : 85± 2° C
Humidity : 85± 3% RH
Time : 1000± 12hrs
Measured at room temperature after placing for 2 to 3hrs
(AEC-Q200-REV C)
Frequency : 10-2000-10Hz for 20 min.
Amplitude: Parts mounted within 2" from any secure point
Directions and times : X, Y, Z directions for 20 min.
This cycle shall be performed 12 times in each of three
mutually perpendicular directions.
(Total 12hours).
(MIL-STD-202 Method 204 D Test condition B)
Preheat : 150± 5° C
Duration : 5 minutes
Temperature : 260± 5° C, 20-40 seconds
(IPC/JEDEC J-STD-020C)
Terminals should be covered by over 95%
solder on visual inspection.
After dip into flux dip into solder
235± 5° C, 4± 1seconds
Flux, solder for lead free
(ANSI/J-STD-002C Method B)
Random Vibration
Test
Reflow Test
Solder test
Halogen
Free
NOTE : Specifications subject to change without notice. Please check our website for latest information.
HF
25.02.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
Microchip MCU
京公网安备 11010802033920号
EEWORLD
