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STT3457P

Description
P-Channel Enhancement Mode MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size689KB,4 Pages
ManufacturerSECOS
Websitehttp://www.secosgmbh.com/
Download Datasheet Parametric View All

STT3457P Overview

P-Channel Enhancement Mode MOSFET

STT3457P Parametric

Parameter NameAttribute value
MakerSECOS
package instructionROHS COMPLIANT, MINIATURE, TSOP-6
Reach Compliance Codecompli
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage30 V
Maximum drain current (ID)4 A
Maximum drain-source on-resistance0.05 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-G6
Number of components1
Number of terminals6
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeP-CHANNEL
Maximum pulsed drain current (IDM)20 A
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON
STT3457P
Elektronische Bauelemente
-4 A, -30 V, R
DS(ON)
60 m
P-Channel Enhancement Mode MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
These miniature surface mount MOSFETs utilize
a high cell density trench process to provide Low R
DS(on)
and to ensure minimal power loss and heat dissipation.
Typical applications are DC-DC converters and power
management in portable and battery-powered products
such as computers, printers, PCMCIA cards, cellular and
cordless telephones.
F
A
E
6
5
4
TSOP-6
L
B
1
2
3
FEATURES
C
K
H
J
Low R
DS(on)
provides higher efficiency and extends
battery life.
Low thermal impedance copper leadframe TSOP-6
saves board space.
Fast switching speed
High performance trench technology
DG
REF.
A
B
C
D
E
F
PACKAGE INFORMATION
Package
TSOP-6
MPQ
3K
LeaderSize
7’ inch
Millimeter
Min.
Max.
2.70
3.10
2.60
3.00
1.40
1.80
1.10 MAX.
1.90 REF.
0.30
0.50
REF.
G
H
J
K
L
Millimeter
Min.
Max.
0
0.10
0.60 REF.
0.12 REF.
10°
0.95 REF.
D
D
D
D
G
S
ABSOLUTE MAXIMUM RATINGS
(T
A
=25°C unless otherwise specified)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
1
Symbol
V
DS
V
GS
T
A
= 25
°C
T
A
= 70
°C
Ratings
-30
±20
-4
-3.2
-20
-1.7
2
1.3
-55 ~ 150
62.5
110
Unit
V
V
A
A
A
W
°C
I
D
I
DM
I
S
Pulsed Drain Current
2
Continuous Source Current (Diode Conduction)
1
Power Dissipation
1
Operating Junction and Storage Temperature Range
Maximum Junction to Ambient
1
T
A
= 25
°C
T
A
= 70
°C
P
D
Tj, Tstg
Thermal Resistance Ratings
t
5 sec
Steady State
R
JA
°C
/ W
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
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