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SSD50N06-15D

Description
N-Ch Enhancement Mode Power MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size388KB,4 Pages
ManufacturerSECOS
Websitehttp://www.secosgmbh.com/
Download Datasheet Parametric View All

SSD50N06-15D Overview

N-Ch Enhancement Mode Power MOSFET

SSD50N06-15D Parametric

Parameter NameAttribute value
MakerSECOS
package instructionSMALL OUTLINE, R-PSSO-G2
Reach Compliance Codecompli
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage60 V
Maximum drain current (ID)51 A
Maximum drain-source on-resistance0.013 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-252
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)200 A
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
SSD50N06-15D
Elektronische Bauelemente
N-Ch Enhancement Mode Power MOSFET
51A, 60V, R
DS(ON)
13 mΩ
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
TO-252(D-Pack)
DESCRIPTION
These miniature surface mount MOSFETs utilize high cell density
process. Low R
DS(on)
assures minimal power loss and conserves energy,
making this device ideal for use in power management circuitry. Typical
applications are PWM DC-DC converters, power management in portable
and battery-powered products such as computers, printers, battery charger,
telecommunication power system, and telephones power system.
A
B
FEATURES
C
D
Low R
DS(on)
Provides Higher Efficiency and Extends Battery Life
Miniature TO-252 Surface Mount Package Saves Board Space
High power and current handling capability
Low side high current DC-DC Converter applications
K
GE
HF
PRODUCT SUMMARY
V
DS
(V)
60
PRODUCT SUMMARY
R
DS
(on) m(
13 @V
GS
= 10V
18 @V
GS
= 4.5V
M
J
Millimeter
Min.
Max.
6.4
6.8
5.20
5.50
2.20
2.40
0.45
0.58
6.8
7.3
2.40
3.0
5.40
6.2
0.8
1.20
N
O
P
I
D
(A)
51
44
REF.
REF.
A
B
C
D
E
F
G
H
J
K
M
N
O
P
Millimeter
Min.
Max.
2.30 REF.
0.70
0.90
0.50
1.1
0.9
1.6
0
0.15
0.43
0.58

Drain

Gate

Source
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise specified)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
a
Pulsed Drain Current
b
Continuous Source Current (Diode Conduction)
a
Power Dissipation
a
Operating Junction and Storage Temperature Range
Maximum Thermal Resistance Junction-Ambient
a
Maximum Thermal Resistance Junction-Case
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
SYMBOL
V
DS
V
GS
I
D
@T
C
=25℃
I
DM
I
S
P
D
@T
C
=25℃
T
J
, T
STG
R
θJA
R
θJC
THERMAL RESISTANCE RATINGS
RATINGS
60
±20
51
40
30
50
-55 ~ 175
50
3.0
UNIT
V
V
A
A
A
W
°C
°C / W
°C / W
27-Sep-2010 Rev. B
Page 1 of 4

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