1206H0500563MXTE03 datasheet, PDF

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1206H0500563MXTE03: DescriptionFeed Through Capacitor, 2 Function(s), 50V, EIA STD PACKAGE SIZE 1206; CategoryAnalog mixed-signal IC filter; File Size413KB，2 Pages; ManufacturerKnowles; Websitehttp://www.knowles.com

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1206H0500563MXTE03 Overview

Feed Through Capacitor, 2 Function(s), 50V, EIA STD PACKAGE SIZE 1206

1206H0500563MXTE03 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Knowles
package instruction	EIA STD PACKAGE SIZE 1206
Reach Compliance Code	compliant
Other features	FLEXICAP TERMINATION
capacitance	56000 µF
filter type	FEED THROUGH CAPACITOR
high	1.1 mm
Minimum insulation resistance	10000 MΩ
JESD-609 code	e0
length	3.2 mm
Manufacturer's serial number	X2Y
Installation type	SURFACE MOUNT
Number of functions	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
method of packing	REEL
physical size	L3.2XB1.6XH1.1 (mm)/L0.126XB0.063XH0.043 (inch)
Rated voltage	50 V
Terminal surface	Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
width	1.6 mm

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sales@syfer.co.uk

www.syfer.com

Surface mount EMI filters

X2Y Integrated Passive Components

X2Y

The Syfer X2Y Integrated Passive Component is a 3

terminal EMI chip device.

When used in balanced line applications, the

revolutionary design provides simultaneous line-to-

line and line-to-ground filtering, using a single ceramic

chip. In this way, differential and common mode

filtering are provided in one device.

For unbalanced applications, it provides ultra low ESL

(equivalent series inductance). Capable of replacing 2

or more conventional devices, it is ideal for balanced

and unbalanced lines, twisted pairs and dc motors, in

automotive, audio, sensor and other applications.

Available in sizes from 0603 to 2220, these filters can

prove invaluable in meeting stringent EMC demands.

Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC.

+44 1603 723310

+44 1603 723301

Dielectric

X7R or C0G/NP0

Typical capacitance matching

Better than 5%

Temperature rating

-55°C to 125°C

Insulation resistance

100Gohms or 1000s (whichever is the less)

Syfer Technology Limited

Electrical configuration

Multiple capacitance

Capacitance measurement

At 1000hr point

Dielectric withstand voltage

<200V 2.5 times rated Volts for 5 secs

500V 1.5 times rated Volts for 5 secs

Charging current limited to 50mA Max.

Type

Chip size

Rated

voltage

16Vdc

25Vdc

50Vdc

100Vdc

200Vdc

500Vdc

Dielectric

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

150pF

15nF

120pF

12nF

10pF - 100pF

150pF - 10nF

560pF - 820pF

56nF - 68nF

390pF - 470pF

18nF - 47nF

10pF - 330pF

470pF - 15nF

0603

1.6±0.2

(0.063±0.008)

0.8±0.2

(0.03±0.008)

0.5±0.15

(0.02±0.006)

0.4±0.15

(0.016±0.006)

0.25±0.15

(0.010±0.006)

E03

0603

0805

1206

1410

1812

2220

Minimum and maximum capacitance values

1.8nF - 3.3nF

1.2nF - 1.5nF

56nF - 220nF

22pF - 1.0nF

1.5nF - 47nF

22pF - 1.0nF

820pF - 33nF

0805

2.0±0.3

(0.08±0.012)

1.25±0.2

(0.05±0.008)

1.0±0.15

(0.04±0.006)

0.5±0.25

(0.02±0.01)

0.3±0.15

(0.012±0.006)

6.8nF - 8.2nF

470nF

4.7nF - 5.6nF

180nF - 400nF

100pF - 3.9nF

4.7nF - 150nF

100pF - 3.3nF

1.2nF - 120nF

1206

3.2±0.3

(0.126±0.012)

1.60±0.2

(0.063±0.008)

1.1±0.2

(0.043±0.008)

0.95±0.3

(0.037±0.012)

0.5±0.25

(0.02±0.01)

12nF - 15nF

820nF

8.2nF - 10nF

390nF - 680nF

820pF - 6.8nF

8.2nF - 330nF

820pF - 5.6nF

2.7nF - 180nF

820pF - 3.9nF

2.7nF - 100nF

1410

3.6±0.3

(0.14±0.012)

2.5±0.3

(0.1±0.012)

2.0 max.

(0.08 max.)

1.20±0.3

(0.047±0.012)

0.5±0.25

(0.02±0.01)

22nF - 33nF

1.2µF

18nF

560nF - 1.0µF

1.0nF - 15nF

10nF - 470nF

1.0nF - 15nF

4.7nF - 470nF

1.0nF - 10nF

4.7nF - 180nF

2220

5.7±0.4

(0.22±0.016)

5.0±0.4

(0.2±0.016)

2.5 max.

(0.1 max.)

2.25±0.4

(0.09±0.016)

0.75±0.25

(0.03±0.01)

Notes: 1) For some lower capacitance parts, higher voltage

rated parts may be supplied.

1812

4.5±0.35

(0.18±0.014)

3.2±0.3

(0.126±0.012)

2.1 max.

(0.08 max.)

1.4±0.35

(0.06±0.014)

0.75±0.25

(0.03±0.01)

Notes: 1) All dimensions mm (inches).

2) Pad widths less than chip width gives improved mechanical performance.

3) The solder stencil should place 4 discrete solder pads. The un-printed distance between

ground pads is shown as dim E.

4) Insulating the earth track underneath the filters is acceptable and can help avoid

displacement of filter during soldering

but can result in residue entrapment under the chip.

Recommended solder lands

0603

0.6 (0.024)

0.4 (0.016)

0.2 (0.008)

0.4 (0.016)

0805

0.95 (0.037)

0.9 (0.035)

0.3 (0.012)

0.4 (0.016)

0.75 (0.030)

1206

1.2 (0.047)

0.9 (0.035)

0.6 (0.024)

0.8 (0.031 )

1.0 (0.039)

1410

2.05 (0.08)

1.0 (0.040)

0.7 (0.028)

0.9 (0.035)

1.85 (0.071)

1812

2.65 (0.104)

1.4 (0.055)

0.8 (0.031)

1.4 (0.055)

2.05 (0.080)

2220

4.15 (0.163)

1.4 (0.055)

1.2 (0.047)

1.8 (0.071)

3.95 (0.156)

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